6-K
Nano Dimension Ltd. (NNDM)
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
Form 6-K
Report of Foreign Private Issuer
Pursuant to Rule 13a-16 or 15d-16
under the Securities Exchange Act of 1934
For the month of: November 2021 (Report No. 2)
Commission file number: 001-37600
NANO DIMENSION LTD.
(Translation of registrant’s name into English)
2 Ilan Ramon
Ness Ziona 7403635 Israel
(Address of principal executive offices)
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F ☒ Form 40-F ☐
Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulations S-T Rule 101(b)(1):_____
Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulations S-T Rule 101(b)(7):_____
CONTENTS
Attached hereto and incorporated herein is the Registrant’s press release issued on November 8, 2021, titled “Nano Dimension Announces New DragonFly IV 3D-Printer and FLIGHT Software Package. Creates Breakthrough in Additively Manufactured Electronics (AME).”
The first three paragraphs and the section titled “Forward-Looking Statements” in the press release are incorporated by reference into the registration statements on Form F-3 (File No. 333-233905 and 333-251155) and Form S-8 (File No. 333-214520 and 333-248419) of the Company, filed with the Securities and Exchange Commission (“SEC”), to be a part thereof from the date on which this report is submitted, to the extent not superseded by documents or reports subsequently filed or furnished.
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SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
| Nano Dimension Ltd. | ||
|---|---|---|
| (Registrant) | ||
| Date: November 8, 2021 | By: | /s/ Yael Sandler |
| Name: | Yael Sandler | |
| Title: | Chief Financial Officer |
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Exhibit 99.1
NanoDimension Announces New DragonFly IV 3D-Printer
andFLIGHT Software Package.
CreatesBreakthrough in Additively Manufactured Electronics (AME)
| ● | DragonFly IV enables manufacturing of new classes of High-Performance Electronic Devices (Hi-PEDs®) |
|---|---|
| ● | FLIGHT software provides end-to-end, complete design-to-manufacturing process for Additively Manufactured Electronics |
| --- | --- |
Sunrise, Florida, November 8, 2021 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (“Nano Dimension”, Nasdaq: NNDM), an industry-leader in Additively Manufactured Electronics (AME), Printed Electronics (PE), and Micro Additive Manufacturing (Micro-AM), today introduces its new DragonFly IV printer and FLIGHT software platform.
Nano Dimension is the leading provider of intelligent machines for the fabrication of AME. The new DragonFly IV system, combined with FLIGHT software, delivers new levels of quality, efficiency, and print resolution in the 3D printed electronics sector - providing increased flexibility to design any 3D geometry and create innovative new products.
DragonFly IV is a Dielectric & Conductive-Materials Additive Manufacturing System aimed for fabrication of High-Performance Electronic Devices (Hi-PEDs®) by depositing the proprietary materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, transformers, and electro-mechanical components.
J.A.M.E.S GmbH from Munich, Germany, is a joint venture with Hensoldt and a DragonFly IV beta-customer. Its Chief Executive Officer, Andreas Muller, commented: “The DragonFly IV is a milestone within the evolution of AME technology. Nano Dimension’s latest system, combined with the new FLIGHT software, enables the completion of complex jobs like no other AME system before. The J.A.M.E.S electronic design engineers’ community will greatly benefit from better access to AME solutions enabled by the FLIGHT software platform and the first-of-a-kind collaboration of ECAD/MCAD 3D design and testing.”
DragonFlyIV 3D-AME Printer
DragonFly IV delivers improved accuracy of traces, spacing, and vias, improved PCB product quality, and the ability to design and produce 3D Hi-PEDs® in a one-step production process.
New capabilities include:
| ● | Integration<br> with Nano Dimension’s new FLIGHT software |
|---|---|
| ● | Integration<br> of 3D elements in PCB |
| --- | --- |
| ● | 3D<br> designed Hi-PEDs® |
| --- | --- |
| ● | Support<br> of HDI level elements |
| --- | --- |
| ● | 75µm<br> traces; 100µm spacing; 150µm via |
| --- | --- |
| ● | Enhanced<br> print quality, optimizing yield with predictable conductivity |
| --- | --- |
| ● | Low<br> thickness variation <5% |
| --- | --- |
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“DragonFly IV is the latest innovation in our present line of AME products. Combined with the FLIGHT software, it expands the electronic & mechanical performance envelop of AME devices and the fabrication ability thereof” said Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension. “With the ability to leverage rapid and environmentally friendly additive manufacturing processes, customers can change and metamorphose form, fit, and function. DragonFly IV will enable agile and rapid customization and personalization, as well as allows for the innovative structuring of electronics in the third dimension. Nano Dimension is bringing a completely new design and fabrication paradigms shifts to the electronics industry.”
FLIGHTSoftware Package
Nano Dimension’s new FLIGHT software suite provides a comprehensive first-of-a-kind ability to incorporate ECAD designs into real 3D MCAD designs, as well as intelligent verification, slicing, and job control solutions. FLIGHT enables the 3D design of electrical and mechanical features in 3-dimensions while ensuring that the new product designs comply with the system’s requirements and can then proceed directly to fabrication on the DragonFly IV.
The Flight Software Suite consists of 3 components:
1-FLIGHTPlan: Allows designers to develop viable 3D AME using both existing 2D design data, and novel 3D data. Tests show that this reduces the 3D AME design time by up to 10 times.
| ● | Integrates<br> 3D MCAD and ECAD capabilities for 3D Electro-Mechanical design |
|---|---|
| ● | Imports<br> existing designs from major ECAD systems |
| --- | --- |
| ● | Enables<br> the use of customers’ existing design tools |
| --- | --- |
2-FLIGHTCheck: This application enables design rule checks so that the designs meet the DragonFly IV requirements and are ready for printing.
| ● | Unifies<br> design rules for ECAD that meet the constraints of DragonFly IV |
|---|---|
| ● | Reduces<br> design iteration cycles |
| --- | --- |
3-FLIGHTControl: Delivers an entirely new pre-production solution that enables concurrent fabrication of both 2D and 3D multi-material Hi- PEDs®, improving productivity.
| ● | Integrates<br> system and job management toolsets |
|---|---|
| ● | Supports<br> new file formats (STL & ODB++) |
| --- | --- |
| ● | Improves<br> user experience through better rendering accuracy and user interface |
| --- | --- |
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Availability
Both DragonFly IV and FLIGHT are available for order. To find out more, visit Nano Dimension at the productronica show, which will take place on November 16-19, 2021, in Munich, Germany, or at (website link for products).
AboutNano Dimension
NanoDimension’s (Nasdaq: NNDM) vision is to transform the electronics and similar additive manufacturing sectors through thedevelopment and delivery of environmentally friendly and economically efficient additive manufacturing, Industry 4.0 solution, whileenabling a one-production-step-conversion of digital designs into functioning devices - on-demand, anytime, anywhere.
NanoDimension plans to execute on this vision by building an eco-friendly and intelligent distributed network of additively manufacturingself-learning & self-improving systems, which are designed to deliver a superior ROI to their owners as well as to Nano Dimensionshareholders and stakeholders.
TheDragonFly IV® system serves cross-industry High-Performance Electronic Devices (Hi-PEDs®)fabrication needs, by depositing proprietary conductive and dielectric materials simultaneously, while concurrently integratingin-situ capacitors, antennas, coils, transformers, and electromechanical components. The outcomes are Hi-PEDs® which are integralenablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. These products enable iterativedevelopment, IP safety, fast time-to-market, and device performance gains. With DragonFly IV®, a revolution happens at the clickof a button, allowing customers to go from CAD to a functional device in a matter of hours instead of weeks; creating products with betterperformance; reducing the size and weight of electronic parts and devices; enabling innovation; and, critically important, protectingIP, all the while limiting environmental pollution and chemical waste.
NanoDimension’s Fabrica 2.0 micro additive manufacturing system enables the production of microparts based on a Digital LightProcessor (DLP) engine that achieves repeatable micron levels resolution. The Fabrica 2.0 is engineered with a patented array of sensorsthat allows a closed feedback loop, using proprietary materials to achieve very high accuracy while remaining a cost-effective mass manufacturingsolution. It is used in the areas of micron-level resolution of medical devices, micro-optics, semi-conductors, micro-electronics, micro-electro-mechanicalsystems (MEMS), microfluidics, and life sciences instruments.
Formore information, please visit www.nano-di.com.
InNovember 2021, Nano Dimension announced the acquisition of Essemtec AG, located in Lucerne Canton, Switzerland. Essemtec developsproduction equipment for electronic assembly. The company’s core business is in adaptive, highly flexible SMT pick-and-place equipment,materials dispenser suitable for both high speed dispensing and micro dispensing as well as an intelligent production material storageand logistics system. Read more at: https://investors.nano-di.com/press-releases/news-details/2021/Nano-Dimension-Acquires-Essemtec-AG-Surface-Mount-Pick--Place-Systems-Supplier-for-the-PCB-and-OEM-Industries/default.aspx
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Forward-LookingStatements
This press release contains forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995 and other Federal securities laws. Words such as “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks,” “estimates” and similar expressions or variations of such words are intended to identify forward-looking statements. For example, Nano Dimension is using forward-looking statements in this press release when it discusses the benefits of the DragonFly IV system and FLIGHT software, that the J.A.M.E.S community will greatly benefit from a better access to AME solutions enabled by the FLIGHT software platform, that DragonFly IV will enable agile and rapid customization or personalization, and that Nano Dimension is bringing a completely new paradigm of opportunity to the electronics industry. Because such statements deal with future events and are based on Nano Dimension's current expectations, they are subject to various risks and uncertainties. Actual results, performance, or achievements of Nano Dimension could differ materially from those described in or implied by the statements in this press release. The forward-looking statements contained or implied in this press release are subject to other risks and uncertainties, including those discussed under the heading “Risk Factors” in Nano Dimension’s annual report on Form 20-F filed with the Securities and Exchange Commission (“SEC”) on March 11, 2021, and in any subsequent filings with the SEC. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. References and links to websites have been provided as a convenience, and the information contained on such websites is not incorporated by reference into this press release. Nano Dimension is not responsible for the contents of third-party websites.
NANODIMENSION INVESTOR RELATIONS CONTACT
Yael Sandler, CFO | [email protected]
U.S.Investor Relations:
Dave Gentry
RedChip Companies Inc.
407-491-4498 or 1-800-RED-CHIP (733-2447)
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