CRDO · Credo Technology Group Holding Ltd · Investor Relations

Credo Demonstrates OmniConnect Running on AMD Versal™ Adaptive SoC Architecture to Offer System Integrators Terabyte-Class Memory Capacity and Bandwidth Without Waiting on Custom Silicon SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it is showcasing high-performance memory scaling for programmable logic-based AI accelerators this week at the 2026 OCP Global Summit in San Jose. Credo will demonstrate its OmniConnect Weaver memory fanout gearbox in a programmable logic-based environment, enabling high memory bandwidth and high memory capacity on an AMD Versal™ AI Edge Series Gen 2 adaptive SoC evaluation board. The system puts memory capacity and bandwidth previously only reserved for custom ASICs within the reach of programmable logic. At the 2026 OCP Global Summit in San Jose, Credo will demonstrate its OmniConnect Weaver memory fanout gearbox in a programmable logic-based environment, enabling high memory bandwidth and high memory capacity on an AMD Versal™ AI Edge Series Gen 2 adaptive SoC evaluation board. News Highlights: Credo and AMD have built a working emulation platform running OmniConnect Weaver memory disaggregation on AMD Versal AI Edge Series Gen 2 adaptive SoC architecture. The platform enables terabytes-class of LPDDR memory with very high capacity and bandwidth to a programmable-logic XPU over VSR links, on standard organic packaging with no silicon interposer. Application software runs unmodified as the expanded memory is transparent above the controller. As AI inference workloads scale, memory bandwidth and capacity have become critical bottlenecks, often constraining performance more than compute throughput itself. Credo's OmniConnect Weaver memory gearbox is designed to address this directly. The AMD Versal adaptive SoC platform provides a highly programmable environment with high performance for faster time to market. By integrating Credo's OmniConnect technology, customers can break the memory ceiling with access to larger memory pools and increased memory throughput without fundamental changes to application software. “Memory is what limits inference today, not compute, and the gap widens every generation,” said Vishal Shah, Vice President of Product, Credo. “By combining the versatile AMD Versal adaptive SoC platform with Credo's OmniConnect Weaver memory expansion technology, we are enabling customers to build scalable memory architectures that can unlock higher performance and greater efficiency for next-generation AI systems.” “As AI inference workloads scale, customers need a practical path to higher memory performance without sacrificing the flexibility that drove the need for a programmable logic design in the first place,” said Manuel Uhm, Director of Silicon Marketing, Adaptive and Embedded Computing Group, AMD. “This collaboration with Credo demonstrates how customers can unlock significantly more memory bandwidth and capacity on the AMD Versal AI Edge Series Gen 2 device while preserving the efficiency, power and time-to-market advantages of programmable logic-based designs.” Credo will demonstrate OmniConnect Weaver on the AMD Versal AI Edge Series Gen 2 adaptive SoC evaluation board at the 2026 OCP Global Summit, Booth B2. More information is available at https://credosemi.com/products/omniconnect/ . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photoni

Joined by Initial Participants Including Leading Hyperscaler and Optical Technology Solution Providers AFL, ams OSRAM, BizLink, Foxlink, Heraeus Covantics, SENKO, and YOFC Under the OCP Networking Project SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, alongside prominent optical technology providers, today announced the launch of the Short-Reach Micro-Emitter Optics (SRMO) Workstream dedicated to developing a specification within the Open Compute Project (OCP) Community that will define a new class of high-speed data center interconnects. Among the first to join with Credo include a leading hyperscaler as well as AFL, ams OSRAM, BizLink, Foxlink, Heraeus Covantics, SENKO, and YOFC, bringing together expertise spanning the full optical connectivity stack to advance the development of the wide, parallel optical connectivity ecosystem. Credo, alongside prominent optical technology providers, has announced the launch of the Short-Reach Micro-Emitter Optics (SRMO) Workstream dedicated to developing a specification within the Open Compute Project (OCP) Community that will define a new class of high-speed data center interconnects. The SRMO Workstream was initiated to address the need for interoperable interconnects as wide, parallel micro-emitter technology drives new form factors across rapidly evolving scale-up and scale-out fabrics in AI data centers. Micro-emitter technology brings new ways of moving volumes of data, while dramatically improving reliability, power efficiency, and bandwidth density. Arrays of micron-scale light sources make up the transmit side of an optical link. Rather than pushing a few optical channels to extreme data rates, many micro-emitters operate in parallel at optimal individual speeds, enabling layer zero redundancy to improve reliability. The SRMO Workstream was initiated to address the need for interoperable interconnects as wide, parallel micro-emitter technology drives new form factors across rapidly evolving scale-up and scale-out fabrics in AI data centers. The specification, targeted for OCP approval in 2027, will address requirements for link power, efficiency, signaling, parallelism, physical form factors – including module and connector footprint, link budget, and compliance. By defining specifications, the SRMO Workstream aims to give data center operators, hyperscalers, and system designers access to a broad ecosystem of interoperable components with supply chain resiliency, accelerating time to deployment and fostering continued innovation in optical connectivity. “As AI workloads scale from thousands to tens of thousands of accelerators, the industry needs a standardized approach to wide, parallel optical connectivity — not a patchwork of components that do not fit together or interoperate,” said L.K. Bhupathi, Associate Vice President of Product at Credo. “Launching the SRMO Workstream reflects Credo’s commitment to solving the interconnect challenges facing AI infrastructure collaboratively, alongside those who will build, deploy, and depend on this ecosystem. We believe that defining specifications, developed through industry collaboration, is the fastest path to bringing wide, parallel optics to scale.” “We continue to advance our micro-emitter, micro-receiver and 3D packaging technologies enabling next-generation wide and parallel AI optical interconnects that support very high bandwidth density,” said Ashkan Seyedi, Vice President and General Manager of Digital Photonics Interconnect at ams OSRAM. “Joining the SRMO Workstream is an important part of our strategy to bring the benefits of reliability, efficiency, and simplicity to connectivity in the AI data center.” “Realizing the power and density benefits of a micro-emitter approach depends on getting the physical connector interface exactly right, especially as channel coun

Micro-Emitter-Based, Pluggable Solution Targets Scale-Out and Front-End Connectivity Up to 50m with Copper-Class Reliability at Lower Power and Reduced Cable Bulk SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today shared details of its 1.6T ZeroFlap active light cable (ALC), the industry’s first row-scale, wide-parallel optical interconnect solution built for AI scale-out and front-end networks. Credo's ZeroFlap Active Light Cable (ALC) is based on a dense array of micro-emitters and photodetectors coupled with flexible, lightweight fiber bundles, designed to draw 12W per cable-end in a pluggable form factor. With targeted reach up to 50m alongside 100 million hours mean time between failures (MTBF), Credo’s ZeroFlap ALC is designed to deliver the reliability, power efficiency, and reach required for next-generation AI infrastructure. The ZeroFlap ALC is based on a dense array of micro-emitters and photodetectors coupled with flexible, lightweight fiber bundles, designed to draw 12W per cable-end in a pluggable form factor. With targeted reach up to 50m alongside 100 million hours mean time between failures (MTBF), Credo’s ZeroFlap ALC is designed to deliver the reliability, power efficiency, and reach required for next-generation AI infrastructure. The 1.6T ALC architecture will be featured in Credo’s booth at the Open Compute Project (OCP) Global Summit this week in San Jose. News Highlights Credo's ZeroFlap ALC will bring wide-parallel, micro-emitter optics to row-scale reach, closing the mid-reach gap between copper's distance limits and the power and cost overhead of traditional pluggable optics. The cable splits 200G lanes into many low-rate optical channels using simple NRZ modulation, avoiding the power and latency costs of complex DSP-based signal processing. Built-in channel redundancy and ZeroFlap link monitoring enable hitless failover, with target reliability of 100 million hours MTBF and bit error rates better than traditional optics. The ZeroFlap ALC is designed to draw 12W per cable-end, roughly 30% less than comparable active electrical cables (AECs), is 10x lighter than AECs and extends the reach to 50m enabling row-scale connectivity. As AI clusters expand across data center rows, operators need connectivity that combines greater reach with reliable, energy-efficient operation. Credo’s 1.6T ZeroFlap ALC will extend the reliability principles behind its field-proven AEC solutions to a new optical architecture. Micro-emitter technology harnesses optical arrays that make up the transmit side of a link. Rather than pushing a few optical channels to extreme data rates, many micro-emitters operate in parallel at optimal individual speeds. This shift from “fast-and-narrow” to “slow-and-wide” enables lower power per bit along with optical links protected with redundancy. “For decades, optical transceivers have prioritized data rate per fiber. Our 1.6T ZeroFlap ALCs are engineered with reliability as the first-order concern,” said L.K. Bhupathi, Associate Vice President of Product at Credo. “The scale-up and scale-out links that form the densest connections in AI data centers demand higher reliability than traditional optics were designed to provide. Credo’s ALCs bring copper-class reliability to these links, enabling larger GPU clusters and higher-throughput connectivity for massive-scale AI deployments.” “As the speeds and distances required for AI exceed the capabilities of copper, there is a gap opening between copper cables and more expensive, power-hungry traditional pluggable optics," said Scott Wilkinson, Lead Analyst, Optical Components at Cignal AI. "Credo’s ZeroFlap ALC addresses this gap with a unique approach that provides row-scale reach while maintaining the reliability and low-cost benefits of AECs.” Credo’s 1.6T ZeroFlap active light cable (A

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its newest optical and copper interconnect products for scaling AI infrastructure at OCP Global Summit 2026, which takes place October 12-15 at the San Jose Convention Center. Credo will showcase its newest optical and copper interconnect products for scaling AI infrastructure at OCP Global Summit 2026, which takes place October 12-15 at the San Jose Convention Center. Credo Booth Demonstration Highlights (Booth B2, October 13-15) Micro-Emitter NPO Enabled Optical Backplane for Scale-Up: Through collaboration with SENKO, Credo has developed a high-reliability micro-emitter blind-mate optical backplane architecture that delivers up to 10x higher bandwidth compared to the latest copper backplanes. 1.6T ZeroFlap Active Light Cable (ALC): Closes a mid-reach gap between copper’s distance limits and the power and cost overhead of traditional pluggable optics. 1.6T ZeroFlap Optics : Transceivers featuring Credo’s latest ZeroFlap DSP and integrated silicon photonics, paired with real-time link telemetry through the Credo PILOT observability platform. 1.6T ZeroFlap Active Electrical Cable (AEC) : Advanced AEC solution delivering high-speed AI interconnects with real-time functional testing, diagnostics, and fault analysis through PILOT. Toucan Gen6 PCIe AEC : PCIe rack-level connectivity solution for GPU-intensive AI workloads, using PILOT to provide real-time telemetry and rapid fault isolation; demonstrated on the CWF Intel platform. OmniConnect Weaver : Credo’s FPGA-implementation of its memory fanout gearbox (Weaver), breaking the AI inference memory wall; demonstrated with a live, interactive GUI. 1.6T Cardinal DSP + SiPho Integration: A fully integrated optical module pairing Credo’s 1.6T Cardinal DSP with an in-house Silicon Photonics PIC, demonstrating multi-vendor live interoperability. Featured Sessions: Executive Session with Credo President and CEO Bill Brennan Wider. Slower. Better: Optics That Can Beat Copper October 12 at 3:20 p.m. – Lower Level – LL21DE Expo Hall Session with Credo AVP of Product LK Bhupathi Going Wide: Scalable and Reliable Optical Interconnects for AI Clusters October 13 at 3:30 p.m. – Concourse Level – Expo Hall Theater Presentations: More Signal, Less Noise: Improving AI Cluster Returns Through Standardized Transceiver Telemetry in the OCP Optics Reliability Workstream October 13 at 2:05 p.m. – Concourse Level – 210AE Chris Collins, Credo AVP of Sales & Optical Product Marketing, Credo Extending Community SONiC for Advanced Optics Telemetry Aligned with OCP Standards October 14 at 3:40 p.m. – Concourse Level – 230A Rajan Pai, VP of Optical Solutions, Credo An Open Lightweight Serial Interconnect for Composable AI Architectures October 15 at 2:15 p.m. – Concourse Level – 211 Vishal Shah, VP of Product, Credo Allan Cantle, CEO, Nallasway To request a meeting or product demo, please contact sales@credosemi.com . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Fol

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its latest optical connectivity technologies and silicon photonics innovations at ECOC 2026, taking place September 21-23 at FYCMA in Málaga, Spain. Credo Booth Demonstration Highlights (Booth #2056) 1.6T 2xDR4 Fully Retimed Module Powered by Credo's Cardinal 802 1.6T DSP and Kfir 200G silicon photonics PIC , the solution delivers advanced optical connectivity to support the growing bandwidth demands of AI and cloud infrastructure. 800G & 1.6T ZeroFlap Optics + PILOT High-performance optical interconnect solutions featuring real-time link health monitoring and root-cause diagnostics through the Credo PILOT observability platform, enabling greater visibility and reliability at AI scale. Presentations Workshop: Can Fast Narrow Channels Keep Rising Without Limit or Will Slow and Wide Become the Winner? September 20 at 4:00 p.m., PV-R Multipurpose Room Credo Speaker: Mohsen Asad, Senior Director of Core Technology Presentation: Scaling Optical Reliability with Bandwidth Across AI Clusters September 23 at 2:40 p.m., Market Focus Theatre Credo Speaker : Rajan Pai, Vice President of Optical Solutions To request a meeting or product demo, please contact sales@credosemi.com . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. Media Contact: Kristin Hehir kristin.hehir@credosemi.com Investor Contact : Dan O’Neil dan.oneil@credosemi.com Source: Credo

Delivers Real-Time Optical Link Health Tracking and Reporting to Accelerate Time to First Token SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its 224G-based family of ZeroFlap (ZF) optical transceivers for AI networks. The new ZF transceivers combine the company's 224G per lane optical DSP with its Kfir200 silicon photonics-based photonic integrated circuit (SiPho PIC) and latest generation PILOT diagnostic and analytics platform . Credo's new ZeroFlap (ZF) optical transceivers combine the company's 224G per lane optical DSP with its Kfir200 silicon photonics-based photonic integrated circuit (SiPho PIC) and latest generation PILOT diagnostic and analytics platform. The launch marks a significant milestone in Credo's optical transceiver roadmap, extending the company's proven ZeroFlap reliability architecture to 1.6T port speeds. Credo's ZF transceivers enable operators to rapidly detect, diagnose, and mitigate fiber issues and link flaps before they impact AI workloads. The launch marks a significant milestone in Credo's optical transceiver roadmap, extending the company's proven ZeroFlap reliability architecture to 1.6T port speeds. These are the first products to incorporate Credo's field-proven DSP with its advanced SiPho PIC. The 1.6T ZF transceivers, available with the PILOT real-time diagnostics platform, enable operators to rapidly detect, diagnose, and mitigate fiber issues and link flaps before they impact AI workloads. Product Highlights: 224G-Based 1.6T Architecture — The ZeroFlap transceiver family is built on Credo's 224G lane technology, delivering 1.6T aggregate bandwidth across 2xDR4, 2xFR4, and DR8 form factors to support the full range of AI scale-out interconnect architectures. ZeroFlap Optical DSP — Credo's latest-generation digital signal processor includes OCP standardized ZeroFlap telemetry features and delivers exceptional per-port power efficiency and signal integrity performance, enabling higher density AI cluster deployments without compromising energy budgets. Kfir200 Silicon Photonics PIC Integration — The co-optimized pairing of Credo's ZeroFlap DSP with the Kfir200 SiPho PIC enables enhanced optical performance through tight integration of the electrical and photonic domains, reducing insertion loss and improving link margin. ZeroFlap Reliability Architecture — Building on the foundation of Credo's 800G ZeroFlap AEC and Optics platform, the 1.6T family extends the same proven reliability architecture to higher port speeds, giving operators confidence that optical link stability and network fabric readiness are maintained as AI clusters scale in size and complexity. PILOT Real-Time Diagnostics Platform — Credo's latest generation PILOT platform provides continuous optical link health monitoring, real-time telemetry streaming, and proactive detection of fiber issues and link flaps before they impact AI workloads — directly reducing time to first token and protecting cluster uptime. SONiC and Open Switch OS Compatibility — PILOT telemetry extensions reside on network switches and support SONiC and other leading switch operating systems, enabling seamless integration into existing AI data center management and monitoring frameworks. “Getting an AI cluster online—and keeping it running—starts with a stable network,” said Ameet Suri, VP of Product at Credo. “ZeroFlap Optics constantly monitor every link with built-in telemetry that detects warning signs to notify operators and avoid costly link flaps. That means customers get their clusters running faster and keep them running longer.” “The 1.6T optical transceiver ramp has begun, with over 11 million forecast to ship in 2026 and more than double that number shipping in 2027," said Scott Wilkinson, Lead Analyst, Optical Components at Cignal AI. “Credo's ZeroFlap transceivers add

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its newest optical and copper interconnect products for scaling AI infrastructure at AI Infra Summit 2026. AI Infra Summit 2026 takes place September 15-17 at the Santa Clara Convention Center in Santa Clara, California. Credo Booth Demonstration Highlights (Booth #810) ZeroFlap Optics : The latest transceivers in the ZeroFlap Optics family built for reliability at AI scale, delivering the bandwidth and operational stability required for large AI deployments. 800G ZeroFlap Optics + PILOT : High-performance optical connectivity paired with real-time link telemetry through the Credo PILOT observability platform, providing enhanced visibility into network health and performance. 1.6T ZeroFlap Active Electrical Cable (AEC) + PILOT: Advanced AEC solution delivering high-speed AI interconnects with telemetry, diagnostics, and fault analysis capabilities through PILOT. Toucan Gen6 PCIe AEC + PILOT: PCIe connectivity solution providing real-time telemetry and rapid fault isolation for GPU-intensive AI workloads. Panels and Presentations: Panel: Scale-Out: Network Architectures for Accelerating Distributed AI Workloads at Scale September 15 at 2:20 p.m. as part of the Data Movement Track Credo Speaker: Don Barnetson, Senior Vice President of Product Presentation: Breaking the AI Inference Memory Wall with Credo OmniConnect September 16 at 11:30 a.m. in Expo Theater 2 Credo Speaker: Vishal Shah, Vice President of Product Presentation: ZeroFlap Optics: Scaling Reliability with Bandwidth September 17 at 11:00 a.m. as part of the Compute Track Credo Speaker: Rajan Pai, Vice President of Optical Solutions To request a meeting or product demo, please contact sales@credosemi.com . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. Media Contact: Kristin Hehir kristin.hehir@credosemi.com Investor Contact : Dan O’Neil dan.oneil@credosemi.com Source: Credo

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (Nasdaq: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced financial results for the first quarter of fiscal year 2027, ended August 1, 2026. First Quarter of Fiscal Year 2027 Financial Highlights Revenue of $479.0 million, grew by 9.6% quarter over quarter and 114.7% year over year GAAP gross margin of 64.5% and non-GAAP gross margin of 68.0% GAAP operating expenses of $188.4 million and non-GAAP operating expenses of $95.2 million GAAP net income of $129.4 million and non-GAAP net income of $236.3 million GAAP diluted net income per share of $0.67 and non-GAAP diluted net income per share of $1.20 Ending cash and short-term investment balance of $764.3 million Management Commentary Bill Brennan, Credo’s President and Chief Executive Officer, stated, “During the first quarter of fiscal 2027, Credo delivered revenue of $479.0 million and non-GAAP net income of $236.3 million, representing 115% and 140% year-over-year growth respectively. Our portfolio now spans connectivity from millimeters to kilometers, with solutions across optics and copper. As AI infrastructure scales, we will continue to provide an innovative suite of reliable and energy-efficient connectivity solutions for the data center.” Second Quarter of Fiscal 2027 Financial Outlook Revenue is expected to be between $525 million and $535 million GAAP gross margin is expected to be between 62.9% and 64.9%, and non-GAAP gross margin is expected to be between 67.0% and 69.0% GAAP operating expenses are expected to be between $199 million and $204 million, and non-GAAP operating expenses are expected to be between $100 million and $105 million Conference Call Credo will conduct a conference call on Tuesday, September 1, 2026, at 2:00 p.m. Pacific Time to discuss its financial results for the first quarter of fiscal year 2027, ended August 1, 2026. Interested parties may join the conference call by dialing 833-461-5787 (toll-free) or +1 585-542-9983 (international). The conference ID for the call is 702097177. It is recommended that participants dial in to the call at least 10 minutes before the start of the call. A live webcast of the conference call will be available on Credo’s Investor Relations website at http://investors.credosemi.com . A replay of the webcast will be available via the web at http://investors.credosemi.com . Discussion of Non-GAAP Financial Measures This press release contains references to the non-GAAP financial measures of non-GAAP gross profit, non-GAAP gross margin, non-GAAP operating expenses, non-GAAP operating income (loss), non-GAAP operating income (loss) margin, non-GAAP net income (loss) and non-GAAP diluted net income (loss) per share. Reconciliation of these non-GAAP measures to their comparable GAAP measures is included below. This non-GAAP information should not be construed as an alternative to the reported results determined in accordance with GAAP. The non-GAAP financial measures that Credo presents may not be comparable to similarly titled measures of other companies and other companies may not calculate such measures in the same manner as we do. Non-GAAP financial measures exclude the effect of share-based compensation expenses, acquisition and integration related costs, amortization of acquired intangible assets, asset impairment and related charges (if applicable), and the related tax effect adjustment to the provision for income taxes. Credo uses a full-year non-GAAP tax rate to compute the non-GAAP tax provision. This full-year non-GAAP tax rate is based on Credo’s annual GAAP income, adjusted to exclude non-GAAP items, as well as the effects of significant non-recurring and period-specific tax items which vary in size and frequency. Credo’s non-GAAP tax rate is determined on an annual basis and may be adjusted during the year to take into account events that may m

Supports Development of Interoperable Near-Package and Co-Packaged Optical Interconnects for Next-Generation AI Infrastructure SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it is now a member of the Open CPX MSA (Open Co-packaged Interface Multi-Source Agreement). Credo joins a growing consortium of companies collaborating through the Open CPX MSA to advance interoperable near-package and co-packaged optical interconnect architectures for future AI scale-out and scale-up networks. News Highlights: Credo joins the Open CPX MSA to help drive an ecosystem of interoperable optical solutions that deliver the bandwidth, density, and power efficiency required for next-generation AI infrastructure. Established in March of 2026, the Open CPX MSA is developing open specifications for optimized optical engines that enable high-speed, high-density connectivity between ASICs and near-package optics (NPO) and co-packaged optics (CPO) interconnects. The Open CPX MSA specifications will standardize mechanical, thermal, electrical, optical, and management interfaces, helping ensure interoperability and accelerate the adoption of next-generation AI networking architectures. Credo will support silicon photonics-based photonic integrated circuits (SiPho PICs), optical DSPs, and other components for the Open CPX MSA standard. “The Open CPX MSA provides an important framework for advancing an open, multi-vendor ecosystem as the industry explores new architectures to scale AI by bringing optical connectivity closer to the ASIC,” said Ronnen Lovinger, Vice President of Silicon Photonics at Credo. “Joining the Open CPX MSA will enable Credo to support the ecosystem with a full suite of SiPho PICs, optical DSPs and other components to meet the growing needs of our customers.” As AI infrastructure scales, moving data between ASICs and optical interconnects becomes increasingly challenging due to the power, signal integrity, and density limitations of high-speed electrical connections. By bringing optical connectivity closer to the ASIC, CPO and NPO architectures can reduce the distance data must travel electrically before being converted to light. The Open CPX MSA brings the industry together to advance next-generation optical solutions that improve AI network efficiency and scalability while preserving the flexibility and benefits of a multi-vendor ecosystem. The initial target of the MSA is an optimized optical engine with a defined pluggable socket and electrical connector system that supports both optical and copper connectivity. About the Open CPX MSA Open CPX MSA is an international organization dedicated to easing the adoption of optical engines by providing commonized mechanical and performance parameters for ecosystem suppliers and end users. Its goal is to reduce power, cost, and latency, while improving bandwidth density, capacity, and the reliability of high-speed co-packaged and near-package interconnects for AI data center applications. For more information about Open CPX MSA, please visit www.OpenCPXMSA.org . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable ou

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that its Toucan Gen6x16 PCI Express ® (PCIe®) retimer has successfully achieved PCI-SIG ® 6.x retimer compliance at 64.0 GT/s and is now listed on the PCI-SIG Integrators List. Credo's Toucan Gen6x16 PCI Express® (PCIe®) retimer has successfully achieved PCI-SIG® 6.x retimer compliance at 64.0 GT/s and is now listed on the PCI-SIG Integrators List. Key points: Credo's Toucan Gen6x16 PCIe retimer successfully completed PCI-SIG 6.x retimer compliance testing at the recent PCI-SIG Compliance Workshop which concluded on July 31. Toucan is now listed on the PCI-SIG Integrators List, giving customers added confidence in standards-based PCIe 6.0 deployment. The compliance milestone validates Toucan across electrical compliance, interoperability, and expanded PCIe 6.0 retimer protocol requirements. Toucan combines PCIe 6.0 performance with DSP-based SerDes, low-power operation and deep diagnostics through PILOT software. Purpose-Built for Next-Gen Platforms Toucan retimers address integration challenges in AI, HPC, and accelerated compute environments with: PCIe 6.0 technology-compatible interoperability Low-power design for dense accelerator platforms Advanced debug and diagnostics through award-winning PILOT tool Architecture aligned with PCIe 7.0 technology roadmaps “As AI infrastructure scales from individual servers to rack-scale and cluster-scale architectures, the role of PCIe architecture connectivity becomes increasingly important," said Vishal Shah, Vice President of Product at Credo. “Achieving PCIe 6.0 specification compliance and inclusion on the PCI-SIG Integrators List validates the ability of Credo’s PCIe retimer to deliver the signal integrity, interoperability, diagnostics, and power efficiency required by next-generation AI systems. This milestone gives customers confidence that Toucan is ready for production deployment in the most demanding accelerated computing environments.” “We congratulate Credo on achieving PCI-SIG 6.x compliance for its Toucan retimers,” said Al Yanes, PCI-SIG President and Chairperson. “Industry collaboration and adherence to open standards are essential to advancing the PCI Express technology ecosystem.” Key Customer Benefits PCIe 6.0 specification x16 readiness for AI, HPC, cloud, and accelerated compute platforms. Reduced integration and qualification risk through standards-based validation. Faster platform bring-up and root-cause debug using PILOT diagnostics and telemetry. Reliable operation across complex high-speed topologies and high-loss channels. Low-power design for dense accelerator and server environments. The successful completion of PCI-SIG 6.x retimer testing underscores Credo's continued execution in high-speed connectivity and reinforces Toucan as a key building block for reliable PCIe 6.0 technology deployment in modern AI infrastructure. To learn more about Credo’s PCIe retimer solutions, visit https://credosemi.com/products/pcie/ . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more inf

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that Bill Brennan, President and CEO, and Dan Fleming, CFO, are scheduled to present at the following upcoming investor conference. Conference: 2026 Goldman Sachs Communacopia + Technology Conference Date: Thursday, September 10, 2026 Time: 10:50 a.m. PT Location: San Francisco, California The presentation will be webcast live on Credo’s IR website at http://investors.credosemi.com/ . The webcast replay will be available as soon as possible following the event on Credo’s IR website. About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI. Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. Media Contact: Diane Vanasse diane.vanasse@credosemi.com Investor Contact : Dan O’Neil dan.oneil@credosemi.com Source: Credo

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced it will hold a conference call on Tuesday, September 1, 2026, at 2:00 p.m. Pacific Time to discuss its financial results for the fiscal first quarter ended August 1, 2026. The news release announcing the first quarter fiscal year 2027 financial results will be disseminated on September 1, 2026 after the market closes. Interested parties may join the conference call beginning at 2:00 p.m. Pacific Time on Tuesday, September 1, 2026 by dialing 833-461-5787 (toll-free) or +1 585-542-9983 (international). The conference ID for the call is 702097177. It is recommended that participants dial in to the call at least 10 minutes before the start of the call. A live webcast of the conference call will be available on Credo’s Investor Relations website at http://investors.credosemi.com/ . A replay of the webcast will be available via the web at http://investors.credosemi.com/ . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI. Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. Media Contact: Diane Vanasse diane.vanasse@credosemi.com Investor Contact : Dan O’Neil dan.oneil@credosemi.com Source: Credo

Enabling an Open Ecosystem of OmniConnect Products from Credo and Third Parties Based on Standardized Interconnect to Alleviate Dependence on High-Bandwidth Memory (HBM) SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its plans to standardize an interconnect within the Open Compute Project (OCP) Community for addressing the memory wall challenge. The memory wall is the gap between how fast processors can compute and how fast memory can supply data, causing expensive compute resources to sit idle waiting for data. In modern AI inference environments, memory bandwidth and capacity—not compute power—are often the dominant constraints on system performance. Credo has formed the OCP Open Chiplet Economy (OCE) Lightweight Serial Interconnect (LSI) Workstream to develop interconnect solutions to overcome the memory bottlenecks that limit AI inference scalability in data infrastructure. In combination with the creation of the OCE LSI Workstream, Credo intends to contribute its OmniConnect lightweight AXI framer specification to OCP, with the goal to advance an open ecosystem of OmniConnect products from Credo and third parties that enable memory disaggregation and chip-to-chip communications. News Highlights: Credo plans to standardize an interconnect within the Open Compute Project (OCP) Community to help address the memory wall, the growing gap between processor performance and memory access speeds. Credo has established the OCP Open Chiplet Economy (OCE) Lightweight Serial Interconnect (LSI) Workstream and plans to contribute its OmniConnect lightweight AXI framer specification. The initiative aims to reduce dependence on costly, capacity-constrained HBM by enabling composable AI architectures that can deliver up to 25x greater memory density and 5% higher bandwidth than HBM4. Credo is helping to create an open, interoperable ecosystem for memory disaggregation and chip-to-chip communications. Credo has formed the OCP Open Chiplet Economy (OCE) Lightweight Serial Interconnect (LSI) Workstream to develop interconnect solutions to overcome the memory bottlenecks that limit AI inference scalability in data infrastructure. In combination with the creation of the OCE LSI Workstream, Credo intends to contribute its OmniConnect lightweight AXI framer specification to OCP, with the goal to advance an open ecosystem of OmniConnect products from Credo and third parties that enable memory disaggregation and chip-to-chip communications. High-Bandwidth Memory (HBM) suffers from very high cost, limited availability, and density issues. The standardization of a lightweight, high-efficiency serial interconnect option promotes the flexible composition of chiplet-based and modular AI systems and reduces reliance on HBM. AI system designers can flexibly compose domain-specific architectures optimized for diverse and evolving AI models, data flows, and workload characteristics, enabling up to 25x increase in memory density and 5% increase in bandwidth compared to HBM4. The effort supports the broader industry transition toward composable infrastructure—where compute, memory, and storage can be optimally combined—helping unlock higher performance, better resource utilization, and greater cost efficiency for AI at scale. “We formed the OCP LSI Workstream to address a clear industry need for innovative interconnect solutions that address the memory wall problem while also enabling a new generation of high-bandwidth and power-optimized modular architectures for AI systems,” said Vishal Shah, Vice President of Product, Credo. “Advancing an open approach to lightweight framing and serial interconnect is critical to enabling flexible chiplet integration, including near-package pluggable configurations, for the next wave of AI inference.” “We welcome Credo’s leadership in helping to

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its latest interconnect products for AI memory and storage applications this week at the FMS (Future of Memory and Storage) 2026 conference. The FMS 2026 conference will take place August 4-6 at the Santa Clara Convention Center. Credo will showcase its latest interconnect products for AI memory and storage applications at the FMS (Future of Memory and Storage) 2026 conference taking place August 4-6 at the Santa Clara Convention Center. “The ability to move data reliably and efficiently across compute, memory, and storage resources is increasingly becoming the defining factor in AI infrastructure performance,” said Vishal Shah, Vice President of Product at Credo. “At Credo, we deliver innovative and reliable connectivity solutions that help overcome memory and storage bottlenecks, enabling systems with higher bandwidth, greater throughput, and more efficiency. We're excited to join industry leaders at the Future of Memory and Storage conference to showcase how these advances are accelerating AI at scale.” Credo Product Highlights (Booth #1146): OmniConnect Weaver solution : An AI memory and chip-to-chip interconnect that breaks through the memory bottlenecks that limit AI inference scalability. OmniConnect Weaver combines ultra-efficient 112G VSR SerDes with a lightweight AXI framer to deliver up to 25x increase in memory density and 5% increase in bandwidth compared to HBM4. PCIe® 6.0 technology-capable Toucan PCIe retimer : Extends PCIe reach between CPUs, GPUs, accelerators, and storage enabling greater system design flexibility for next-generation AI infrastructure. Toucan PCIe retimer provides high-performance signal conditioning across challenging channels while also providing structured observability with Credo’s PILOT diagnostic and analytics software platform. Chat with the Experts Event Vishal Shah, Vice President of Product, Credo will participate in the Beer, Pizza & Chat with the Experts event on Wednesday, August 5 at 7:15 pm on the topic of AI Data Center Storage Architecture / Memory & Storage AI Acceleration. FMS Best of Show Awards Finalist Credo has been named a finalist for the FMS Best of Show Awards for its OmniConnect Weaver interconnect solution in two separate award categories: AI Application and User Implementation. The award winners will be announced at the conference on Tuesday, August 4 at 6:00 pm. To request a meeting or product demo, please contact sales@credosemi.com . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI. Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. Media Contact: Kristin Hehir kristin.hehir@credosemi.com Investor Contact : Dan O’Neil dan.oneil@credosemi.com Source: Credo

Company Named a USA TODAY Top Workplace and San Francisco Bay Area Top Workplace for Creating People-First Culture SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, has been recognized as a winner of the prestigious 2026 USA TODAY Top Workplaces award for the second year in a row. The award reflects Credo’s continued commitment to fostering a workplace culture that empowers employees, celebrates collaboration, and fuels innovation. Credo has been named a USA TODAY Top Workplace and a San Francisco Bay Area Top Workplace for creating people-first culture. The USA TODAY Top Workplaces awards honor organizations with 150 or more US employees that have built exceptional, people-first cultures. This year, more than 100,000 organizations were invited to participate. Winners are determined based on authentic employee feedback gathered through an anonymous survey conducted by Energage, the HR research and technology company behind the Top Workplaces program since 2006. Results are calculated from employee responses to key statements aligned with specific workplace experience themes, and are proven indicators of high-performing organizations. The results also placed Credo as a winner in the 2026 San Francisco Bay Area Top Workplaces program, conducted in partnership with Axios, for the third year in a row, and a 2026 Culture Excellence Awards winner in multiple categories—all based on employee feedback from Energage’s workplace survey. Credo was honored in the following core areas of the employee experience proven to drive performance: Innovation, Work-Life Flexibility, Compensation and Benefits, Leadership, Purpose and Values, Professional Development, Employee Well-Being and Employee Appreciation. “Being named a USA TODAY Top Workplace, and a San Francisco Bay Area Top Workplace, is especially meaningful because it reflects the voices of our employees—the people who shape our culture every day,” said Bill Brennan, President and CEO, Credo. “At Credo, we believe that strong teams, a shared sense of purpose, and a culture of trust and respect are essential to long-term success. This recognition reflects the exceptional people across our company and reinforces our commitment to creating an environment where innovation can thrive and everyone has the opportunity to make an impact.” “Earning a USA TODAY Top Workplaces award is a testament to an organization’s credibility and commitment to a people-first culture," said Eric Rubino, CEO of Energage. "This award, driven by real employee feedback, is more than just a recognition—it’s proof that your employees believe in the organization and its leadership. Job seekers and customers look for this trusted badge of credibility and excellence. It signals a company that values its people, and that kind of culture resonates in

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Nasdaq: CRDO) (“Credo”), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today reported financial results for the fourth quarter and full fiscal year 2026, ended May 2, 2026. Fourth Quarter of Fiscal Year 2026 Financial Highlights Revenue of $437.0 million grew by 7.4% quarter over quarter and 157.0% year over year GAAP gross margin of 68.2% and non-GAAP gross margin of 68.3% GAAP operating expenses of $142.2 million and non-GAAP operating expenses of $81.7 million GAAP net income of $169.1 million and non-GAAP net income of $226.7 million GAAP diluted net income per share of $0.88 and non-GAAP diluted net income per share of $1.16 Ending cash and short-term investment balance of $1.4 billion Management Commentary Bill Brennan, Credo’s President and Chief Executive Officer, stated, “Fiscal 2026 marked another defining year for Credo. For the year, revenue more than tripled to $1.3 billion, and non-GAAP net income increased more than five times to $662 million. As we enter into fiscal 2027, Credo expects to achieve continued strong financial performance with our innovative and vertically integrated approach that enables customers to accelerate cluster time-to-stability, maximize GPU utilization, improve network reliability, and reduce overall infrastructure power and operating costs.” First Quarter of Fiscal Year 2027 Financial Outlook Revenue is expected to be between $465.0 million and $475.0 million GAAP gross margin is expected to be between 66.9% and 68.9%, and non-GAAP gross margin is expected to be between 67.0% and 69.0% GAAP operating expenses are expected to be between $167.6 million and $171.6 million, and non-GAAP operating expenses are expected to be between $86.0 million and $90.0 million Webcast and Conference Call Information Credo will conduct a conference call on Monday, June 1, 2026, at 2:00 p.m. Pacific Time to discuss its financial results for the fourth quarter and fiscal year 2026, ended May 2, 2026. Interested parties may join the conference call by dialing 833-461-5787 (toll-free) or +1 585-542-9983 (international). The conference ID for

Expands Optical Connectivity Portfolio to Include Silicon Photonics Photonic Integrated Circuits SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it has completed its acquisition of DustPhotonics. DustPhotonics brings industry-leading silicon photonics photonic integrated circuit (SiPho PIC) technology for optical connectivity, deepening Credo’s optical interconnect portfolio across 800G, 1.6T, and 3.2T near-packaged optics (NPO) and co-packaged optics (CPO). With this technology, Credo is now positioned with a vertically integrated connectivity stack spanning SerDes, digital signal processing (DSP), silicon photonics, and system integration for scale-out and scale-up networks — addressing both electrical and optical interconnects across the full AI infrastructure buildout. Credo announced that it has completed its acquisition of DustPhotonics. DustPhotonics brings industry-leading silicon photonics photonic integrated circuit (SiPho PIC) technology for optical connectivity, deepening Credo’s optical interconnect portfolio across 800G, 1.6T, and 3.2T near-packaged optics (NPO) and co-packaged optics (CPO). With this technology, Credo is now positioned with a vertically integrated connectivity stack spanning SerDes, digital signal processing (DSP), silicon photonics, and system integration for scale-out and scale-up networks — addressing both electrical and optical interconnects across the full AI infrastructure buildout. With the addition of DustPhotonics, the company expects its combined portfolio of ZeroFlap optical transceivers, optical DSPs, and silicon photonics products to become a significant growth driver in fiscal 2027, reflecting strong customer traction and expanding adoption across hyperscale AI deployments. “I am thrilled to officially welcome the talented team from DustPhotonics to Credo,” said Bill Brennan, President and CEO, Credo. “Today marks an important milestone as we join two deeply skilled organizations united by a shared commitment to innovation, execution, and customer impact. Together, we will continue to advance a powerful, end-to-end optical connectivity solution platform with reliability and power efficiency at its core, helping our customers scale AI infrastructure.” “Today we celebrate that DustPhotonics is now a part of Credo,” said

Collaboration Enables Reliable Scaling of AI Inference Workloads and Faster Time to First Token SAN JOSE, Calif. & SEOUL, South Korea--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, and Rebellions, a global leader in AI inference infrastructure, are working together to bring turnkey, scalable AI factories to enterprises around the world. The collaboration integrates Credo’s ZeroFlap active electrical cables (AECs)—designed to deliver consistent, link flap-free connectivity—into the production-ready, high-performance Rebellions RebelPOD™. By integrating Credo’s ZeroFlap AECs, Rebellions helps enterprises accelerate time to first token and unlock AI cluster productivity. Credo’s ZeroFlap active electrical cables (AECs)—designed to deliver consistent, link flap-free connectivity—are integrated into the production-ready, high-performance Rebellions RebelPOD™. [Photo of the Rebellions RebelPOD™ courtesy of Rebellions.] Inference workloads must deliver immediate responsiveness, predictable latency, and continuous availability, often across large, distributed clusters operating at high utilization. Even brief connectivity instability or component failures can delay inference requests, increase queue times, and degrade user experience. Credo’s ZeroFlap AECs virtually eliminate intermittent link disruptions, reduce operational troubleshooting, and simplify maintenance, enabling AI infrastructure to remain online and performant as it scales. With Credo’s renowned plug-and-play purple AECs integrated into the Rebellions RebelPOD architecture, enterprises can deploy AI inference capacity faster while maintaining operational stability over time. “AI inference infrastructure must be designed not only for performance, but also for continuous operation at scale,” said Bill Brennan, President and CEO, Credo . “The integration of Credo’s ZeroFlap AECs in the Rebellions RebelPOD architecture enables enterprises to deploy AI factories that deliver exceptional uptime, reliability, and serviceability—key requirements for delivering fast time to stability and revenue.” “Rebellions is focused on making AI inference infrastructure practical, efficient and accessible for enterprises and organizations worldwide,” said Sunghyun Park, Co-Founder and CEO, Rebellions . “In collaboration with Credo, we are streamlining AI adoption at scale—from development to deployment—and minimizing infrastructure complexity so customers can utilize AI inference faster, with lower operational risk.” Credo’s award-winning ZeroFlap AECs are known for delivering highly reliable interconnect for AI backend networks, operating without link flaps for billions of field operating hours. Credo ZeroFlap AECs are the interconnects fo

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that Bill Brennan, President and CEO, and Dan Fleming, CFO, are scheduled to present at the following upcoming investor conferences. Conference: 2026 Evercore TMT Global Conference Date: Wednesday, June 3, 2026 Time: 8:20 a.m. PT Location: San Francisco, California Conference: 2026 BofA Global Technology Conference Date: Thursday, June 4, 2026 Time: 9:20 a.m. PT Location: San Francisco, California The presentations will be webcast live on Credo’s IR website at http://investors.credosemi.com/ . Webcast replays will be available as soon as possible following the events on Credo’s IR website. About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI. Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. Media Contact: Diane Vanasse diane.vanasse@credosemi.com Investor Contact : Dan O’Neil dan.oneil@credosemi.com Source: Credo

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO) an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced it will hold a conference call on Monday, June 1, 2026, at 2:00 p.m. Pacific Time to discuss its financial results for the fourth quarter and fiscal year ended May 2, 2026. The news release announcing the fourth quarter and fiscal year 2026 financial results will be disseminated on June 1, 2026 after the market closes. Interested parties may join the conference call beginning at 2:00 p.m. Pacific Time on Monday, June 1, 2026 by dialing 833-461-5787 (toll-free) or +1 585-542-9983 (international). The conference ID for the call is 721028678. It is recommended that participants dial in to the call at least 10 minutes before the start of the call. A live webcast of the conference call will be available on Credo’s Investor Relations website at http://investors.credosemi.com/ . A replay of the webcast will be available via the web at http://investors.credosemi.com/ . About Credo Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI. Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners. <div class="b

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will participate in the global TSMC 2026 Technology Symposium events, kicking off on April 22 nd in Santa Clara, California. Credo will participate in the global TSMC 2026 Technology Symposium events, kicking off on April 22nd in Santa Clara, California. Credo will be at the following TSMC 2026 Technology Symposiums and Workshops: April 22 nd - North America Technology Symposium, Santa Clara, booth #502 May 5 th - Austin Technology Workshop May 14 th - Boston Technology Workshop May 14 th - Taiwan Technology Symposium, Hsinchu May 28 th - Europe Technology Symposium, Amsterdam June 25 th - China Technology Symposium, Shanghai July 3 rd - Japan Technology Symposium, Yokohama At each event, Credo will spotlight the first solution in its OmniConnect family , Weaver, designed to break through the memory bottlenecks that limit AI inference scalability. Weaver combines ultra-efficient 112G VSR SerDes, available in TSMC 5nm and 3nm processes, with a lightweight AXI framer to deliver high-bandwidth, low-latency, and power-optimized connectivity between compute engines and memory—whether on-die, off-substrate, or across chiplets. Compared to conventional LPDDR5X, OmniConnect Weaver provides a 10x boost in I/O beachfront density and a 20x increase in memory density 1 . In addition to Weaver, Credo will also highlight its 224G PAM4 SerDes Intellectual Property (IP), proven in TSMC 3nm process. By enabling 224G per lane data transmission, the technology provides ultra-high speed 1.6Tbps bandwidth for the build out of next-generation AI, cloud computing and hyperscale applications. “Credo has a longstanding partnership with TSMC and we share a vision for accelerating AI through innovation and collaboration,” said Jeff Twombly, Vice President of Business Development at Credo. “TSMC’s Technology Symposium events bring the ecosystem together to learn, network, and exchange ideas. We value the opportunity to be part of these important discussions which are shaping the energy-efficient, scalable AI architecture of the future.” About

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, released its Fiscal Year (FY) 2025 Greenhouse Gas (GHG) Report, detailing its FY2025 operational emissions inventory. The report reflects Credo’s commitment to transparent reporting and the thoughtful management of its environmental footprint as the company continues to scale. Credo released its Fiscal Year (FY) 2025 Greenhouse Gas (GHG) Report, detailing its FY2025 operational emissions inventory. The report reflects Credo’s commitment to transparent reporting and the thoughtful management of its environmental footprint as the company continues to scale. The 2025 GHG Report focuses on direct office emissions across Credo’s global footprint (Scope 1), as well as purchased electricity consumed across its offices and laboratories (Scope 2). Credo worked with Carbonhound, a GHG accounting platform provider, to support calculation of Scope 1 and Scope 2 emissions using standardized emissions factors and calculation methodologies. The company’s emissions data has undergone independent third-party verification by Brightspot Climate Inc., reinforcing the accuracy and reliability of its disclosures. “At Credo, high-quality emissions data isn’t a reporting exercise—it’s a business input that shapes how we operate and how we support our customers with consistent, reliable information,” said Bill Brennan, CEO of Credo. “This report reflects the discipline we’re building around measurement and verification, giving us the visibility we need as we scale to meet growing demand for energy-efficient infrastructure.” Credo’s 2025 GHG Report builds upon the emissions baseline established in prior years and provides a consistent framework for ongoing disclosure. Credo plans to continue annual reporting of its GHG inventory and work toward including Scope 3 emissions in future disclosures to deliver a more comprehensive view of its value chain impact. To view Credo’s 2025 GHG Report, visit the link here . Additional information about the company’s environmental, social and governance (ESG) initiatives can be found on Credo’s ESG page . About

Acquisition will bring industry-leading Silicon Photonics PIC technology in-house, expanding Credo's addressable market and deepening its optical interconnect portfolio across 800G, 1.6T, and 3.2T NPO and CPO SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency for the next generation of AI-driven applications, cloud computing, and hyperscale networks, today announced it has entered into a definitive agreement to acquire DustPhotonics, a leading developer of Silicon Photonics Photonic Integrated Circuit (SiPho PIC) technology for optical transceivers. The acquisition will position Credo with a vertically integrated connectivity stack spanning SerDes, Digital Signal Processing (DSP), Silicon Photonics and system integration for scale out and scale up networks — addressing both electrical and optical interconnects across the full AI infrastructure buildout. Credo Agrees to Acquire DustPhotonics, Accelerating Expansion into Silicon Photonics and Next Generation Optical Connectivity Strategic Rationale The acquisition of DustPhotonics directly accelerates Credo's optical interconnect roadmap and significantly expands its served addressable market in the global optical industry. DustPhotonics has developed a differentiated portfolio of SiPho PICs spanning 400G, 800G, and 1.6T, with a roadmap extending to 3.2T, that integrates key optical functions onto a single chip, reducing component complexity, improving manufacturing yields, and enabling meaningfully lower cost at scale as port speeds advance beyond 800G. In combination, these factors improve AI cluster reliability, a critical factor for data center operators. These SiPho PICs are deployed in transceivers at leading hyperscale AI clusters and are also in design for leading Near Port Optics (NPO) and Co-Packaged Optics (CPO) applications. According to LightCounting 1 and Credo estimates, the SiPho PIC market is expected to grow to $6 billion by 2030. Critically, SiPho PIC technology is a foundational component of Credo's ZeroFlap (ZF) Optical Transceiver platform. Bringing this capability in-house mitigates external supply dependencies, accelerates product development cycles, and creates a pathway to substantial cost structure improvement at volume. Combined with Credo's industry-leading SerDes and DSP intellectual property and products, the acquisition creates an end-to-end optical connectivity solution platform. Credo believes it has reached an inflection point in its optical business. With the addition of DustPhotonics, the company expects its combined portfolio of ZeroFlap Optical Transceivers, Optical DSPs, and Silicon Photonics products to generate greater than $500 million in optical revenue in fiscal 2027 , reflecting strong customer traction and expanding adoption across hyperscale AI deployments. Quotes Wi

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO) and TE Connectivity Corporation (NYSE: TEL) have reached a license and settlement agreement relating to AEC technology. Based on this agreement, all lawsuits between the two companies will be promptly dismissed. The terms of the agreement remain confidential. About Credo Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications, including the 100G (or Gigabits per second), 200G, 400G, 800G and the emerging 1.6T (or Terabits per second) port markets. Credo products are based on our proprietary Serializer/Deserializer (SerDes) and Digital Signal Processor (DSP) technologies. Our product families include Integrated Circuits (ICs) for the optical and line card markets, Active Electrical Cables (AECs) and SerDes Chiplets. Our intellectual property (IP) solutions consist primarily of SerDes IP licensing. For more information, please visit https://www.credosemi.com . Follow Credo on LinkedIn . About TE Connectivity TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more. Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on <a href="https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fedge.prnewswire.com%2Fc%2Flink%2F%3Ft%3D0%26l%3Den%26o%3D4646575-1%26h%3D4074388472%26u%3Dhttps%253A%252F%252Fwww.linkedin.com%252Fcompany%252Fte-connectivity%252F%26a%3DLinkedIn&esheet=54467477&newsitemid=20260327292789&lan=en-US&anchor=LinkedIn&index=5&md5=e24d31db1b52c71d8e58e74180760f7a" rel="nofollow" shape=

Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, has reached a cross-license and settlement agreement with Molex, LLC. Based on this agreement, the lawsuits will be promptly dismissed, bringing an end to all patent disputes between the two companies. The terms of the agreement remain confidential. About Credo Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications,