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6-K

Taiwan Semiconductor Manufacturing Co Ltd (TSM)

6-K 2024-09-25 For: 2024-08-31
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Added on April 07, 2026

1934 Act Registration No. 1-14700

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

_____________________________

FORM 6-K

_____________________________

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

For the month of September 2024

(Commission File Number: 001-14700)

_____________________________

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

_____________________________

No. 8, Li-Hsin Rd. 6,

Hsinchu Science Park,

Taiwan, R.O.C.

(Address of Principal Executive Offices)

_____________________________

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x            Form 40-F  o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o

SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Ltd.
--- --- ---
Date:   September 25, 2024 By /s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) the unsecured bonds issued by TSMC and its subsidiaries for the month of August 2024.

1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

Title Name Number of shares held as of Changes
7/31/2024 8/31/2024
Senior Vice President and Chief Information Security Officer J.K. Lin 13,829,462 13,880,462 51,000
Senior Vice President Cliff Hou 499,822 500,919 1,097
Senior Vice President and Chief Financial Officer Wendell Huang 1,660,190 1,660,199 9
Vice President Geoffrey Yeap 75,532 78,532 3,000
Vice President Jonathan Lee 404,709 406,001 1,292
Vice President K.C. Hsu 95,927 100,927 5,000
Vice President Ray Chuang 285,318 286,318 1,000

Note: Shareholdings include shares held by the related parties.

2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: Inapplicable.

3.The acquisition and disposition of assets by TSMC and its subsidiaries:

(1) Fixed-income investment: NT$26.1 billion of acquisition and NT$0.5 billion of disposition.

(2) Machinery equipment: NT$1.0 billion of disposition.

4.The capital appropriations approved by TSMC board of directors: (1) Machinery equipment for advanced technology capacity: US$14,216 million. (2) Machinery equipment for advanced packaging, mature and/or specialty technology capacity: US$7,079 million. (3) Real estate and capitalized leased assets: US$8,320 million.

5.The unsecured bonds issued by TSMC and its subsidiaries: Inapplicable.