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6-K

Taiwan Semiconductor Manufacturing Co Ltd (TSM)

6-K 2026-05-12 For: 2026-05-12
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Added on July 04, 2026

1934 Act Registration No. 1-14700

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

_____________________________

FORM 6-K

_____________________________

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

For the month of May 2026

(Commission File Number: 001-14700)

_____________________________

Taiwan Semiconductor Manufacturing Company Limited

(Translation of Registrant’s Name Into English)

_____________________________

No. 8, Li-Hsin Road 6

Hsinchu Science Park

Hsinchu 300-096, Taiwan Republic of China

(Address of Principal Executive Offices)

_____________________________

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x            Form 40-F  o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1): o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7): o

SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
Taiwan Semiconductor Manufacturing Company Limited
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Date:   May 12, 2026 By /s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer

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TSMC Board of Directors Meeting Resolutions

HSINCHU, Taiwan, R.O.C., May 12, 2026 – The TSMC (TWSE: 2330, NYSE: TSM) Board of Directors today held a meeting, which passed the following resolutions:

1.Approved the 2026 first quarter Business Report and Financial Statements. First quarter consolidated revenue was NT$1,134.10 billion and net income was NT$572.48 billion, with diluted earnings per share of NT$22.08.

2.Approved the distribution of a NT$7.0 per share cash dividend for the first quarter of 2026, and set September 22, 2026 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be September 16, 2026. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (September 18 through September 22, 2026) for registration transfer, and the dividend will be paid on October 8, 2026. In addition, the ex-dividend date and the record date for entitlement to participate in this cash dividend distribution for TSMC American Depositary Shares (ADSs) will be September 16, 2026.

3.To meet long-term capacity plans based on market demand forecasts and TSMC’s technology development roadmap, the Board approved capital appropriations of approximately US$31,284.30 million for purposes mainly including: 1) Installation of advanced technology capacity; 2) Fab construction, and installation of fab facility systems.

4.Approved the capital injection of not more than US$20 billion to TSMC Arizona, a wholly-owned subsidiary of TSMC.

5.Approved the following personnel promotion: (1) Promoted Vice President, Corporate Planning Mr. Jonathan Lee to Senior Vice President (2) Promoted Senior Director, Quality & Reliability Mr. Y.H. Wu to Vice President (3) Promoted Senior Director, Research and Development / Nano Patterning Technology Dr. Y.C. Ku to Vice President (4) Promoted Senior Director, Operations / Intelligent Manufacturing Center Mr. Span Lu to Vice President

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 305 distinct process technologies, and manufactured 12,682 products for 534 customers in 2025 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

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TSMC Spokesperson: Media Contacts:
Wendell Huang<br>Senior Vice President and CFO Nina Kao<br><br>Head of Public Relations<br><br>Tel: 886-3-5636688 ext.7125036<br><br>Mobile: 886-988-239-163<br><br>E-Mail: [email protected] Baker Li<br><br>Public Relations<br><br>Tel: 886-3-5636688 ext.7125037<br><br>Mobile: 886-988-932-757<br><br>E-Mail: [email protected]

Taiwan Semiconductor Manufacturing Company Limited

| This is to report the major financials for the three months ended March 31, 2026 approved by the TSMC Board of Directors. All figures were prepared in accordance with TIFRS on a consolidated basis. | | --- || (In NT$ thousands, except for EPS) | | --- || Comprehensive Income Statements Items<br><br>(for the three months ended March 31, 2026) | | | --- | --- | | Net sales | 1,134,103,440 | | Gross profit | 751,295,421 | | Income from operations | 658,966,142 | | Income before tax | 687,799,687 | | Net income | 572,801,304 | | Net income attributable to shareholders of the parent | 572,479,752 | | Basic EPS (NT$) | 22.08 || Balance Sheets Items<br><br>(as of March 31, 2026) | | | --- | --- | | Total assets | 8,660,949,685 | | Total liabilities | 2,728,560,764 | | Equity attributable to shareholders of the parent | 5,890,960,252 |