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Paul H. Pickle

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About Paul H. Pickle

Paul H. Pickle is recorded as CEO at Semtech Corp (SMTC) since June 30, 2023. Semtech Corp reported in an 8-K filed June 7, 2024 that Paul H. Pickle was terminated as President and Chief Executive Officer, effective June 6, 2024. Semtech Corp reported in an 8-K filed June 9, 2023 that Paul H. Pickle was appointed President and Chief Executive Officer, effective June 30, 2023. The proxy statement of Semtech Corp reports total compensation of $6,745,681 for Paul H. Pickle in fiscal 2024, including a base salary of $365,000. Semtech Corp is classified in the Semiconductors industry within the Technology sector. Other leadership on record at Semtech Corp includes Hong Q. Hou (CEO and Board Member), Mark Lin (CFO), Asaf Silberstein (COO) and 7 others.

“On June 6, 2024, the Board of Directors (the “Board”) of Semtech Corporation (“Semtech” or the “Company”) terminated Paul H. Pickle as President and Chief Executive Officer of the Company, without cause.”
Semtech Corp Form 8-K, filed June 7, 2024 · Read the filing
“On June 7, 2023, Mr. Pickle and the Chair of the Board agreed that the Transition Date will be June 30, 2023.”
Semtech Corp Form 8-K, filed June 9, 2023 · Read the filing

Affiliation history

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Current role

Semiconductors · Technology

CEO

2023-01-01–present

Leadership on record at Semtech Corp

Executive compensation

Compensation components disclosed in company proxy statements. Amounts are nominal USD; total is the company-reported figure.

Fiscal year Company Salary Total
2024 Semtech Corp (SMTC) $365,000 $6,745,681

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