SCHMID Group N.V 6-K, filed Jun 16, 2026
SCHMID Group N.V. (SHMD)
About this 6-K
SCHMID Group N.V filed this 6-K on June 16, 2026.
UNITED STATES SECURITIES
AND EXCHANGE
COMMISSION
Washington, D.C. 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER PURSUANT
TO RULE 13a-16 OR 15d-16 UNDER THE SECURITIES
EXCHANGE ACT OF 1934
For the month of June 2026
Commission File Number: 001-42040
SCHMID Group N.V.
(Registrant's name)
Robert-Bosch-Str. 32-36,
72250
Freudenstadt, Germany
Tel: +49 7441 538 0
(Address of principal executive office)
Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F: Form 20-F x Form 40-F
INFORMATION CONTAINED IN THIS REPORT ON FORM 6-K
SCHMID Group Records More Than €26 Million Order Intake Since Mid-May
SCHMID Group N.V. (“SCHMID” or the “Company”) today announced a combined order intake of more than €26 million since mid-May, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.
The recent order intake reflects continued momentum across SCHMID’s InfinityLine Production Equipment, driven primarily by orders secured in China, Taiwan, and South Korea and complemented by incremental business in Europe. Together, these wins confirm sustained customer investment in high-performance electronics manufacturing and further strengthen SCHMID’s position in next-generation interconnect technologies.
The orders, secured from several customers, cover InfinityLine Production Equipment for High-Density Interconnect Multilayer (HDI-ML) and modified Semi-Additive Processing (mSAP) applications serving AI servers, high-speed networking, optical communication modules, advanced interconnect platforms, and next-generation data infrastructure. The orders demonstrate that the market pipeline for advanced PCB technologies is not only building, but converting into confirmed technology and capacity investment.
Press Release Furnished as Exhibits
On June 16, 2026, the Company issued a press release, which is furnished herewith as Exhibit 99.1, providing an update on the share issuances and conversions of convertible notes.
The information furnished in this Form 6-K, including the information contained in Exhibit 99.1 shall not be deemed to be “filed” for the purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or otherwise subject to the liabilities of that section, and shall not be deemed to be incorporated by reference into any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by a specific reference in such filing.
Caution Regarding Forward-Looking Statements
This report contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 that are based upon current expectations or beliefs, as well as assumptions about future events. Forward-looking statements include all statements that are not historical facts and can generally be identified by terms such as “could,” “estimate,” “expect,” “intend,” “may,” “plan,” “potentially,” or “will” or similar expressions and the negatives of those terms. These statements include, but are not limited to, statements relating to the Company’s plan to regain compliance with Nasdaq’s rules, planned financing transactions of the Company, and the Company's future financial performance. Actual results could differ materially from those expressed in or implied by the forward-looking statements due to a number of risks and uncertainties, including but not limited to, the timing of the Company’s submission of a plan to regain compliance, Nasdaq’s acceptance of the plan, the duration of any extension that may be granted by Nasdaq, the potential inability to meet Nasdaq’s requirements, unexpected delays in securing financing or changes to financing agreements and the other risks and uncertainties described in the Company’s SEC reports and under the heading “Risk Factors” in its most recent annual report on Form 20-F which are available at www.sec.gov. These forward-looking statements speak only as of the date of this report. Except as required by law, the Company does not undertake any obligation to update or revise its forward-looking statements to reflect events or circumstances after the date of this report.
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| The following exhibit is furnished herewith | ||
Exhibit Number |
||
| 99.1 | Press release dated June 16, 2026 | |
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SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.
| Dated: June 16, 2026 | SCHMID Group N.V. | |
| By: | /s/ Arthur Schuetz | |
| Name: | Arthur Schuetz | |
| Title: | Chief Financial Officer | |
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Exhibit 99.1
Press Release
SCHMID Group Records More Than €26 Million Order Intake Since Mid-May, Driven by AI Infrastructure and Optical Module Demand
Freudenstadt, Germany, June 16, 2026 – SCHMID Group announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.
The recent order intake reflects continued momentum across SCHMID’s InfinityLine Production Equipment, driven primarily by orders secured in China, Taiwan, and South Korea and complemented by incremental business in Europe. Together, these wins confirm sustained customer investment in high-performance electronics manufacturing and further strengthen SCHMID’s position in next-generation interconnect technologies.
The orders, secured from several customers, cover InfinityLine Production Equipment for High-Density Interconnect Multilayer (HDI-ML) and modified Semi-Additive Processing (mSAP) applications serving AI servers, high-speed networking, optical communication modules, advanced interconnect platforms, and next-generation data infrastructure. The orders demonstrate that the market pipeline for advanced PCB technologies is not only building, but converting into confirmed technology and capacity investment.
Executive Statement
“AI infrastructure is driving a step-change in advanced interconnect manufacturing. As layer counts increase and design rules become more demanding, yield performance becomes the decisive factor for profitable high-volume production. This is where SCHMID creates measurable customer value. Our equipment delivers the process stability, uptime, and manufacturing precision required to support yield performance above 99%. The recent order intake confirms that the market is moving from technology evaluation and qualification into capacity investment — and that SCHMID is strongly positioned to capture the next growth wave in HDI-ML and mSAP for AI infrastructure, high-speed networking, and optical module applications. We see a strong second half of 2026 and continued momentum into 2027, as customers accelerate capacity investments for the next phase of AI infrastructure build-out,” said Roland Rettenmeier, Chief Sales Officer of SCHMID Group.
Market Development
HDI-ML remains the strongest contributor to the recent order intake, with multiple investments secured primarily from customers in China, Taiwan, and South Korea, complemented by additional business in Europe. These projects are linked to capacity expansion and technology upgrades for advanced multilayer printed circuit boards used in high-performance computing, data center, high-speed networking, and communication infrastructure applications.
This regional mix supports SCHMID’s view that advanced interconnect demand remains structurally strong, led by Asia’s core electronics manufacturing ecosystem and selectively expanding in other regions. Customers are investing in higher layer counts, tighter design rules, improved signal integrity, and scalable production for next-generation electronics.
mSAP also contributed to the recent business, underlining SCHMID’s position in the transition toward finer-line PCB manufacturing. mSAP technology is increasingly relevant as the industry moves toward higher routing density, improved electrical performance, and more compact system architectures.
Combined, these orders represent a total order intake of more than €26 million since mid-May 2026. The total order intake from January 1, 2026 until June 15, 2026 thus amounted to approximately €43 million.
SCHMID expects continued momentum in these segments as customers move from evaluation and qualification into capacity investment. SCHMID's pipeline for HDI-ML and mSAP production equipment continues to strengthen, supported by structural growth trends in AI infrastructure, advanced networking, optical communication, and high-density electronics manufacturing.
Forward-Looking Statements
This press release contains statements that constitute "forward-looking statements". All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.
About the SCHMID Group
The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit: www.schmid-group.com