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000050 · 天马微电子股份有限公司 · Debt

6.3100 CNY +0.0200 (+0.32%) At close · Sep 30
Market Cap
15.37B CNY
Shares
2.44B

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Bonds payable 2025-12-31 CNY 799,684,398 Annual report filed 2026-03-14
Lease liabilities 2025-12-31 CNY 26,809,671 Annual report filed 2026-03-14
Long-term borrowings 2025-12-31 CNY 15,985,473,273 Annual report filed 2026-03-14
Short-term borrowings 2025-12-31 CNY 497,327,464 Annual report filed 2026-03-14
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.