000050 · 天马微电子股份有限公司 · Debt
Market Cap
15.37B CNY
Shares
2.44B
Debt Profile
Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.
Reported debt balances
Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.
| Reported balance | As of | Amount | Source |
|---|---|---|---|
| Bonds payable | 2025-12-31 | CNY 799,684,398 | Annual report filed 2026-03-14 |
| Lease liabilities | 2025-12-31 | CNY 26,809,671 | Annual report filed 2026-03-14 |
| Long-term borrowings | 2025-12-31 | CNY 15,985,473,273 | Annual report filed 2026-03-14 |
| Short-term borrowings | 2025-12-31 | CNY 497,327,464 | Annual report filed 2026-03-14 |
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.
Covenants
Covenant terms have not yet been verified for this profile.
The balance figures do not establish whether covenants apply or whether the company complies with them.
Loans, facilities and notes
The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.