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Equibles

300460 · 广东惠伦晶体科技股份有限公司 · Debt

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8.9100 CNY -0.1700 (-1.87%) At close · Sep 30
Rebalance outlook locked
Market Cap
2.50B CNY
Shares
280.80M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2025-12-31 CNY 8,366,116 Annual report filed 2026-04-29
Long-term borrowings 2025-12-31 CNY 234,261,023 Annual report filed 2026-04-29
Short-term borrowings 2025-12-31 CNY 232,608,463 Annual report filed 2026-04-29
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.