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Equibles

300479 · 神思电子技术股份有限公司 · Debt

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14.5800 CNY -0.3500 (-2.34%) At close · Sep 30
Rebalance outlook locked
Market Cap
2.87B CNY
Shares
197.04M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2026-06-30 CNY 1,939,893 Interim report filed 2026-08-18
Short-term borrowings 2026-06-30 CNY 151,965,596 Interim report filed 2026-08-18
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.