300546 · 深圳市雄帝科技股份有限公司 · Debt
Market Cap
3.14B CNY
Shares
187.65M
Debt Profile
Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.
Reported debt balances
Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.
| Reported balance | As of | Amount | Source |
|---|---|---|---|
| Bonds payable | 2026-06-30 | CNY 0 | Interim report filed 2026-08-25 |
| Borrowings from the central bank | 2026-06-30 | CNY 0 | Interim report filed 2026-08-25 |
| Interbank borrowings | 2026-06-30 | CNY 0 | Interim report filed 2026-08-25 |
| Lease liabilities | 2026-06-30 | CNY 7,877,974 | Interim report filed 2026-08-25 |
| Long-term borrowings | 2026-06-30 | CNY 0 | Interim report filed 2026-08-25 |
| Short-term borrowings | 2026-06-30 | CNY 26,610,292 | Interim report filed 2026-08-25 |
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.
Covenants
Covenant terms have not yet been verified for this profile.
The balance figures do not establish whether covenants apply or whether the company complies with them.
Loans, facilities and notes
The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.