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301282 · 金禄电子科技股份有限公司 · Debt

41.6700 CNY -3.8200 (-8.40%) At close · Sep 30
Market Cap
8.79B CNY
Shares
210.93M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2026-06-30 CNY 2,418,116 Interim report filed 2026-08-15
Long-term borrowings 2026-06-30 CNY 203,622,188 Interim report filed 2026-08-15
Short-term borrowings 2026-06-30 CNY 172,027,433 Interim report filed 2026-08-15
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.