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Equibles

603061 · 天津金海通半导体设备股份有限公司 · Debt

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311.7300 CNY -6.7700 (-2.13%) At close · Sep 30
Rebalance outlook locked
Market Cap
27.12B CNY
Shares
87.00M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2026-06-30 CNY 4,783,567 Interim report filed 2026-08-27
Short-term borrowings 2026-06-30 CNY 15,092,827 Interim report filed 2026-08-27
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.