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Equibles

603256 · 宏和电子材料科技股份有限公司 · Debt

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130.7000 CNY -8.3500 (-6.01%) At close · Sep 30
Rebalance outlook locked
Market Cap
118.23B CNY
Shares
904.59M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2026-06-30 CNY 78,379 Interim report filed 2026-08-14
Long-term borrowings 2026-06-30 CNY 967,778,141 Interim report filed 2026-08-14
Short-term borrowings 2026-06-30 CNY 719,435,580 Interim report filed 2026-08-14
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.