603660 · 苏州科达科技股份有限公司 · Debt
Market Cap
5.20B CNY
Shares
571.49M
Debt Profile
Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.
Reported debt balances
Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.
| Reported balance | As of | Amount | Source |
|---|---|---|---|
| Bonds payable | 2024-12-31 | CNY 293,315,000 | Annual report filed 2025-04-26 |
| Lease liabilities | 2024-12-31 | CNY 18,276,034 | Annual report filed 2025-04-26 |
| Short-term borrowings | 2024-12-31 | CNY 190,125,278 | Annual report filed 2025-04-26 |
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.
Covenants
Covenant terms have not yet been verified for this profile.
The balance figures do not establish whether covenants apply or whether the company complies with them.
Loans, facilities and notes
The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.