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603660 · 苏州科达科技股份有限公司 · Debt

9.1000 CNY -0.2000 (-2.15%) At close · Sep 30
Market Cap
5.20B CNY
Shares
571.49M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Bonds payable 2024-12-31 CNY 293,315,000 Annual report filed 2025-04-26
Lease liabilities 2024-12-31 CNY 18,276,034 Annual report filed 2025-04-26
Short-term borrowings 2024-12-31 CNY 190,125,278 Annual report filed 2025-04-26
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.