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Equibles

603890 · 苏州春秋电子科技股份有限公司 · Debt

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14.9700 CNY +0.0600 (+0.40%) At close · Sep 30
Rebalance outlook locked
Market Cap
7.55B CNY
Shares
504.02M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Bonds payable 2026-06-30 CNY 562,935,534 Interim report filed 2026-08-26
Lease liabilities 2026-06-30 CNY 47,927,704 Interim report filed 2026-08-26
Long-term borrowings 2026-06-30 CNY 436,800,000 Interim report filed 2026-08-26
Short-term borrowings 2026-06-30 CNY 614,787,164 Interim report filed 2026-08-26
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.