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688135 · 广东利扬芯片测试股份有限公司 · Debt

36.5000 CNY -1.0300 (-2.74%) At close · Sep 30
Market Cap
8.51B CNY
Shares
233.10M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2026-06-30 CNY 28,955,007 Interim report filed 2026-08-28
Long-term borrowings 2026-06-30 CNY 417,129,419 Interim report filed 2026-08-28
Short-term borrowings 2026-06-30 CNY 94,447,629 Interim report filed 2026-08-28
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.