6-K

Taiwan Semiconductor Manufacturing Co Ltd (TSM)

6-K 2026-03-25 For: 2026-02-28
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Added on April 07, 2026

1934 Act Registration No. 1-14700

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

_____________________________

FORM 6-K

_____________________________

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

For the month of March 2026

(Commission File Number: 001-14700)

_____________________________

Taiwan Semiconductor Manufacturing Company Limited

(Translation of Registrant’s Name Into English)

_____________________________

No. 8, Li-Hsin Road 6

Hsinchu Science Park

Hsinchu 300-096, Taiwan Republic of China

(Address of Principal Executive Offices)

_____________________________

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x            Form 40-F  o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o

SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Limited
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Date:   March 25, 2026 By /s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of February 2026.

1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

Title Name Number of shares held as of Changes
1/31/2026 2/28/2026
Vice President Jonathan Lee 485,797 486,022 225
Vice President B.Z. Tien 3,051 5,051 2,000
Vice President Lipen Yuan 3,180 3,600 420

Note: Shareholdings include shares held by the related parties.

2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: None.

3.The acquisition and disposition of assets by TSMC and its subsidiaries:

(1) Fixed-income investment: NT$3.5 billion of acquisition.

(2) Machinery equipment: NT$1.2 billion of disposition.

4.The capital appropriations approved by TSMC board of directors:

(1) Machinery equipment for advanced technology capacity: US$18,921 million.

(2) Machinery equipment for advanced packaging, mature and/or specialty technology capacity: US$4,670 million.

(3) Real estate and capitalized leased assets: US$21,372 million.

5.The unsecured bonds issued by TSMC and its subsidiaries: None.

6.The cancellation of TSMC common shares: None.