Valens Semiconductor Ltd 6-K, filed Sep 22, 2026
Valens Semiconductor Ltd. (VLN)
About this 6-K
Valens Semiconductor Ltd filed this 6-K on September 22, 2026.
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16
OR 15d-16 UNDER THE SECURITIES EXCHANGE ACT OF 1934
For the month of September 2026
Commission File Number: 001-40842
VALENS SEMICONDUCTOR LTD.
(Exact name of registrant as specified in its charter)
8 Hanagar St. POB 7152
Hod Hasharon 4501309
Israel
(Address of principal executive office)
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F:
Form 20-F ☒ Form 40-F ☐
EXPLANATORY NOTE
On September 14, 2026, Valens Semiconductor Ltd. (“Valens” or the “Company”) entered into a license agreement (the “Agreement”) with Semiconductor Components Industries, LLC (“Onsemi”), a leading U.S.-based global semiconductor manufacturer specializing in intelligent power and sensing solutions for the automotive, industrial, and AI data center markets. Under the Agreement, Valens grants Onsemi a non-exclusive license under Valens’ intellectual property rights to make and sell a specific next-generation integrated image sensor product incorporating Valens’ MIPI A-PHY connectivity technology in exchange for certain royalty payments. The Agreement can be terminated after ten years for convenience upon 180 days' prior written notice (or earlier upon material breach). Upon termination, the license survives with respect to products already on Onsemi’s product roadmap or commercialized prior to termination, subject to continued royalty payments to Valens.
The information contained in this Form 6-K is incorporated by reference into the Registrant’s registration statements on Form F-3 (File No. 333-260390) and Form S-8 (File Nos. 333-259849, 333-269250, 333-276520 and 333-285792 and 333-293747).
A copy of the press release describing the Agreement is furnished as Exhibit 99.1 herewith.
The information in the attached Exhibit 99.1 is being furnished and shall not be deemed “filed” for the purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or otherwise subject to the liabilities of that Section, nor shall it be deemed incorporated by reference in any filing made by the Company under the Securities Act of 1933, as amended, or the Exchange Act, except as otherwise set forth herein or as shall be expressly set forth by specific reference in such a filing.
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TABLE OF CONTENTS
| ITEM | ||
| 99.1 | Press Release dated September 22, 2026 |
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SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
| VALENS SEMICONDUCTOR LTD. | |||
| By: | /s/ Yoram Salinger | ||
| Name: | Yoram Salinger | ||
| Title: | Chief Executive Officer | ||
Date: September 22, 2026
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Exhibit 99.1
Valens Semiconductor to Collaborate with onsemi on a Cost-Optimized Integrated Sensor Based on the MIPI A-PHY Standard
Collaboration agreement to support the development of MIPI A-PHY solutions targeting high-volume 3MP automotive camera applications
HOD HASHARON, Israel - September 22, 2026 - Valens Semiconductor (NYSE: VLN), a leading provider of high-performance connectivity chipsets, today announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration the parties intend to give OEMs and Tier 1s a faster path to A-PHY.
Under the agreement, Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies.
“This is a major milestone for Valens, MIPI A-PHY and for the automotive ecosystem as a whole,” said Yoram Salinger, CEO at Valens Semiconductor. “The integrated, cost-optimized 3MP offering complements Valens’ existing solutions, bringing A-PHY to a much broader range of use cases. Just as importantly, by collaborating with onsemi, another major supplier of A-PHY silicon, we are strengthening the ecosystem and giving automakers the supplier choice they expect from an industry standard.”
“The level of interest we’re seeing from OEM customers and partners makes clear that MIPI A-PHY represents a significant business opportunity,” said Ahmed Salem, Vice President & General Manager of the Intelligent Sensing Group at onsemi. "As automotive imaging systems continue to grow in scale and sophistication, customers are looking for solutions that simplify design without compromising performance. Through our collaboration with Valens, we're helping enable a more streamlined camera architecture that reduces component count, supports industry standards, and ultimately makes advanced vision systems easier to deploy."
The majority of automotive image sensors target the 1-3MP range. As OEMs continue to migrate toward higher resolutions, a 3MP offering addresses both a large established market and a growing upgrade opportunity, making it a highly relevant entry point for bringing A-PHY into mainstream, high-volume vehicles.
MIPI A-PHY is the first standard in the automotive industry for high-speed sensor connectivity. Valens is a leader in MIPI A-PHY, offering the first chipsets on the market to comply with the standard and the first to achieve design wins with multiple OEMs.
About Valens Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens’ chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers or suppliers; any difficulty selling Valens' products if customers do not design its products into their product offerings; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; risks related to our use of AI technologies; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; further deterioration of macroeconomic conditions due to ongoing global political and economic uncertainty; political, economic, governmental and tax consequences, as well as geopolitical tensions, associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 25, 2026 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. Except as required by law, we undertake no obligations to make any revisions to the forward-looking statements contained in this press release or to update them to reflect events or circumstances occurring after the date of this press release, whether as a result of new information, future developments or otherwise.
Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor Ltd.
michal.benari@valens.com