United Microelectronics Corp 6-K, filed Nov 28, 2025
United Microelectronics Corp (UMC)
About this 6-K
United Microelectronics Corp filed this 6-K on November 28, 2025.
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 6-K
REPORT OF FOREIGN ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16
OF THE SECURITIES EXCHANGE ACT OF 1934
November 28, 2025
(Commission File Number: 001-15128)
United Microelectronics Corporation
(Translation of registrant’s name into English)
No. 3 Li-Hsin 2nd Road,
Hsinchu Science Park,
Hsinchu, Taiwan, R.O.C.
(Address of principal executive office)
Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.
Form 20-F Form 40-F
Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101 (b) (1):
Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101 (b) (7):
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereto duly authorized.
United Microelectronics Corporation |
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By: |
Chitung Liu |
Name: |
Chitung Liu |
Title: |
CFO |
Date: November 28, 2025
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www.umc.com
Exhibit
Exhibit Description
99.1 Announcement on 2025/11/24: To clarify news reported by Commercial Times on November 22, 2025
99.2 Announcement on 2025/11/26: Supplement to the unsecured straight corporate bond issuance authorized by the Board of Director resolution passed on April 23rd, 2025
Exhibit 99.1
To clarify news reported by Commercial Times on November 22, 2025
1. Date of occurrence of the event: 2025/11/24
2. Company name: UNITED MICROELECTRONICS CORP.
3. Relationship with the Company (please enter “the company itself” or “subsidiaries”): the company itself
4. Reciprocal shareholding percentage: N/A
5. Name of the reporting media: Commercial Times, B01
6. Content of the report:
Specialty technology process booming for UMC, the momentum expected to continue into next year.
7. Cause of occurrence:
The Company does not comment on speculative reports or market rumors.
8. Countermeasures: None
9. Any other matters that need to be specified: None
Exhibit 99.2
Supplement to the unsecured straight corporate bond issuance authorized by the Board of Director resolution passed on April 23rd, 2025
1. Date of the board of directors’ resolution: NA
2. Name [issue no.__ of (secured, unsecured) corporate bonds of ___________ (company)]:
United Microelectronics Corporation 4th unsecured straight corporate bond issuance in 2025
3. Whether to adopt shelf registration (Yes/No): No
4. Total amount issued:
NT$4,800 million；3 years period NT$2,300 million, 5 years period NT$2,500 million
5. Face value per bond: NT$1 million
6. Issue price: At par
7. Issuance period:3 years, 5 years
8. Coupon rate: Fixed rate, 3 years 1.55% p.a., 5 years 1.60% p.a.
9. Types, names, monetary values and stipulations of collaterals: N/A
10. Use of the funds raised by the offering and utilization plan: Debt Repayment
11. Underwriting method: Public offering through underwriters
12. Trustees of the corporate bonds: CTBC Bank Co., Ltd
13. Underwriter or agent: Masterlink Securities Co., Ltd as the lead underwriter
14. Guarantor(s) for the issuance: None
15. Agent for payment of the principal and interest: CTBC Bank Co., Ltd
16. Certifying institution: None
17. Where convertible into shares, the rules for conversion: N/A
18. Sell-back conditions: None
19. Buyback conditions: None
20. Reference date for any additional share exchange, stock swap, or subscription: N/A
21. Possible dilution of equity in case of any additional share exchange, stock swap, or subscription: N/A
22. Any other matters that need to be specified: None