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FLEX · Flex Ltd. · Investor Relations

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Press releases and events scraped from the company's investor relations website. Past events open our own call or event page when we host one; otherwise listings link to the original source.

Recent news

Date Headline
2026-09-15 Flex Announces Expected Flex CFO and Board Composition for Flex and Axiom Following Separation
2026-09-15 Flex Announces New Company Name for the Planned Cloud and Power Infrastructure Spin-Off and Files Form 10 Registration Statement
2026-09-03 Flex to Participate in Upcoming Investor Conference
2026-09-03 Flex to Acquire EPC Power, Adding Leading Power Conversion Capabilities for AI Data Centers and Grid Applications
2026-07-29 Flex Announces Leadership Teams for Flex and Planned Cloud and Power Infrastructure Spin-Off (SpinCo)
2026-07-29 FLEX REPORTS FIRST QUARTER FISCAL 2027 RESULTS
2026-07-09 Flex and Cerebras Expand Partnership to Scale American Manufacturing of Cerebras AI Supercomputers
2026-07-08 Flex Announces Date for First Quarter Fiscal Year 2027 Earnings Call
2026-06-25 JetCool Launches Turnkey Liquid-Cooled Server Solution to Accelerate Enterprise AI Adoption
2026-06-09 Flex to Join S&P 500 Index
2026-06-01 Flex Showcases Scalable Power Solutions for Next-Generation AI Infrastructure at COMPUTEX 2026
2026-05-22 Flex to Participate in Upcoming Investor Conferences
2026-05-14 JetCool Expands SmartPlate™ System Portfolio with Closed-Loop Cooling for Next-Generation Compute
2026-05-05 Flex Announces Intention to Spin Off its Cloud and Power Infrastructure Segment into a New Independent Publicly Traded Company
2026-05-05 FLEX REPORTS FOURTH QUARTER AND FISCAL 2026 RESULTS
2026-05-04 Flex Completes Acquisition of Electrical Power Products (EP²)
2026-04-22 Flex and Teradyne Robotics Expand Partnership to Scale Intelligent Automation Across Global Manufacturing
2026-04-15 Flex Announces Date for Fourth Quarter and Fiscal 2026 Earnings Call
2026-03-30 Flex Announces Agreement to Acquire Electrical Power Products (EP²)
2026-03-18 Flex named one of the 2026 World’s Most Ethical Companies® for the fourth year in a row

Flex is recognized for raising the bar on business integrity and embedding ethics into everyday decision-making and long‑term strategy. The company is named one of the 2026 World’s Most Ethical Companies® by Ethisphere, a global leader in defining and advancing standards of ethical business practices. This is the fourth consecutive year Flex earned this recognition in the industrial manufacturing category. "Our stakeholders expect transparency, responsibility, and integrity as we rise to the challenges of scale and complexity that global manufacturing demands. Being named a 2026 World’s Most Ethical Companies® honoree once again reflects the trust we earn through our differentiated programs, disciplined processes, and the strong ethical culture that guides our global ecosystem." — Andy Powell, Sr. VP Deputy General Counsel, Chief Ethics & Compliance Officer To earn this achievement, Flex provided 240+ documented proof points on practices that support robust ethics and compliance,

2026-03-16 Flex Launches 800 VDC Power Rack for Next-Generation NVIDIA AI Infrastructure

Flex today announced its 800 VDC Power Rack developed in collaboration with NVIDIA to support the NVIDIA Vera Rubin platform. As part of Flex's AI Infrastructure Platform , the 800 VDC Power Rack extends the company's portfolio of products and services for accelerating AI infrastructure deployment at global scale. Traditional in-rack power distribution systems, designed for kilowatt-scale racks, can no longer support the megawatt-scale demands of modern AI workloads. As power density and system complexity increase to support performance and energy efficiency advances, the 800 VDC architecture announced by NVIDIA has emerged as the new benchmark for AI infrastructure. "Megawatt-scale AI workloads are redefining what's required from data center power infrastructure," said Chris Butler, President, Embedded and Critical Power, Flex. "Flex's 800 VDC Power Rack pairs advanced power products with global manufacturing scale to enable efficient, scalable power delivery and faster deployment of

2026-03-16 Flex Accelerates AI Factory Deployment with NVIDIA Omniverse DSX Reference Designs

Flex (NASDAQ: FLEX) today announced new reference designs for NVIDIA Omniverse DSX Blueprint to accelerate giga-scale AI factory deployment. Built under Flex's AI Infrastructure Platform, the prefabricated modular designs combine power, high-density IT racks and cooling into factory-integrated systems engineered for speed, scalability and system-level performance. "Speed and manufacturing scale now define competitive advantage in AI infrastructure," said Michael Hartung, President and Chief Commercial Officer at Flex. "These reference designs bring together Flex's advanced manufacturing footprint and integration expertise with NVIDIA's AI-driven platform leadership. By engineering the full infrastructure stack as a unified system, we help customers overcome the power, heat and scale challenges of the AI era and bring capacity online faster." The reference designs feature hybrid architectures that support phased migration from traditional AC environments to 800 VDC power architectures

2026-03-16 BYD, Geely, Isuzu, and Nissan Adopt NVIDIA DRIVE Hyperion for Level 4 Vehicles
2026-03-16 Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics
2026-03-11 JetCool Collaborates with Broadcom to Deliver Innovative Liquid Cooling for Next-Generation AI XPUs

JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device. By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and JetCool are enabling AI platforms engineered for

Past events

Date Event Type
2026-09-09 Goldman Sachs Communacopia + Technology conference Conference
2026-07-29 Flex First Quarter Fiscal 2027 Earnings Call Earnings call
2026-06-02 Bank of America Global Technology Conference Conference
2026-05-19 J.P. Morgan 2026 Global Technology, Media and Communications Conference Conference
2026-05-06 Flex Fourth Quarter and Fiscal 2026 Earnings Call Earnings call
2026-03-02 Raymond James 47th Annual Institutional Investors Conference Conference
2026-02-04 Flex Third Quarter Fiscal 2026 Earnings Call Earnings call
2025-12-10 Barclays 23rd Annual Global Technology Conference Conference
2025-12-09 Nasdaq 53rd Investor Conference Conference
2025-12-04 UBS 2025 Global Technology and AI Conference Conference
2025-12-04 Goldman Sachs Industrials and Materials Conference 2025 Conference
2025-10-29 Flex Second Quarter Fiscal 2026 Earnings Call Earnings call
2025-09-09 Goldman Sachs 2025 Communacopia + Technology Conference Conference
2025-07-24 Flex First Quarter Fiscal 2026 Earnings Call Earnings call
2025-06-04 Bank of America 2025 Global Technology Conference Conference
2025-05-14 J.P.Morgan 53rd Annual Global Technology, Media and Communications Conference Conference
2025-05-07 Flex Fourth Quarter and Fiscal 2025 Earnings Call Earnings call
2025-01-29 Flex Third Quarter Fiscal 2025 Earnings Call Earnings call
2024-12-04 UBS Global Technology and AI Conference Conference
2024-10-30 Flex Second Quarter Fiscal 2025 Earnings Call Earnings call
2024-09-09 Goldman Sachs 2024 Communacopia + Technology Conference Conference
2024-07-24 Flex Q1 F25 Earnings Call Earnings call
2024-06-05 Bank of America Global Technology Conference 2024 Conference
2024-05-01 Q4FY24 Earnings Call with 2024 Virtual Investor and Analyst Day Earnings call
2024-03-04 Raymond James 2024 Institutional Investors Conference Conference

Source: https://investors.flex.com/overview/default.aspx

Key facts CIK 866374 CUSIP Y2573F102 13F (30d) 23 filings 19 filers Visit website Investor relations