Taiwan Semiconductor Manufacturing Co Ltd 6-K, filed Sep 24, 2021

Taiwan Semiconductor Manufacturing Co Ltd (TSM)

6-K 2021-09-24 For: 2021-09-24

View Original

Added on April 07, 2026

About this 6-K

Taiwan Semiconductor Manufacturing Co Ltd filed this 6-K on September 24, 2021.

Search and read filings like this one from Claude or ChatGPT with the SEC filings MCP server →



			1934 Act Registration No. 1-14700

UNITED STATES
SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549

		FORM 6-K
	REPORT OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16 OR 15d-16 UNDER THE SECURITIES EXCHANGE ACT OF 1934
		For the month of September 2021 (Commission File Number: 001-14700)
Taiwan Semiconductor Manufacturing Company Ltd. (Translation of Registrant’s Name Into English)
		No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C. (Address of Principal Executive Offices)
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F. Form 20-F ☒ Form 40-F ☐
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):□ Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):□


		Taiwan Semiconductor Manufacturing Company Ltd.
Date:	September 24, 2021	By	/s/ Wendell Huang
			Wendell Huang
			Vice President & Chief Financial Officer


Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of August 2021.

1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
	Title	Name	Number of shares held as of		Changes
			07/31/2021	08/31/2021
	Senior Vice President	Cliff Hou	439,605	440,445	840
	Vice President	Connie Ma	215,000	236,000	21,000
	Vice President	Marvin Liao	315,485	325,485	10,000
	Vice President and Chief Financial Office	Wendell Huang	1,651,677	1,651,692	15
	Vice President	Jun He	7,000	8,000	1,000
	Vice President	Geoffrey Yeap	4.000	8,000	4.000
	Vice President	Jonathan Lee	330,850	331,522	672
	Vice President	L.C. Lu	110,227	120,227	10,000
	Note: Shareholdings include shares held by the related parties.

2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: Inapplicable

3. The acquisition and disposition of assets by TSMC and its subsidiaries:
(1) Fixed-income investment: NT$5.4 billion of acquisition and NT$5.9 billion of disposition.


4. The capital appropriations approved by TSMC board of directors:
(1) Machinery equipment for advanced technology capacity: NT$228.0 billion;
(2) Machinery equipment for advanced packaging, mature and specialty technology capacity: NT$74.5 billion;
(3) Machinery equipment for R&D capital investments and sustaining capital expenditures: NT$12.8 billion;
(4) Real estate and capitalized leased assets: NT$168.0 billion.

5. The unsecured bonds issued by TSMC and its subsidiaries
	Issuance	Tranche	Issuance Period	Total Amount (in billions)	Coupon Rate	Repayment and Interest Payment
	110-4	A	Aug. 2021 ~ Aug. 2025	NT$4.0	0.485%	Bullet repayment; interest payable annually
		B	Aug. 2021 ~ Aug. 2026	NT$8.0	0.50%
		C	Aug. 2021 ~ Aug. 2028	NT$5.4	0.55%
		D	Aug. 2021 ~ Aug. 2031	NT$4.2	0.62%


SIGNATURES



Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.