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300735 · 惠州光弘科技股份有限公司 · Debt

17.5800 CNY -0.2600 (-1.46%) At close · Sep 30
Market Cap
14.33B CNY
Shares
815.07M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Lease liabilities 2025-12-31 CNY 183,945,422 Annual report filed 2026-04-28
Long-term borrowings 2025-12-31 CNY 95,710,944 Annual report filed 2026-04-28
Short-term borrowings 2025-12-31 CNY 1,006,726,830 Annual report filed 2026-04-28
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.