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Equibles

TSM · Taiwan Semiconductor Manufacturing Co Ltd · Debt

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$426.73 +6.51 (+1.55%)
Rebalance outlook locked
Market Cap
$2.16T
Shares
5.19B
Volume · Oct 20 5.34M Avg daily vol (3M) 11.05M

Debt Profile

Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.

Reported debt balances

Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.

Reported balanceAs ofAmountSource
Current bonds issued, including current portion of noncurrent bonds 2025-12-31 TWD 135,806,000,000 20-F filed 2026-04-16
Current portion of long-term borrowings 2025-12-31 TWD 136,925,700,000 20-F filed 2026-04-16
Current portion of long-term borrowings 2025-12-31 USD 4,364,900,000 20-F filed 2026-04-16
Current unsecured bank loans received, including current portion of noncurrent unsecured bank loans 2025-12-31 TWD 1,119,700,000 20-F filed 2026-04-16
Lease liabilities 2025-12-31 TWD 35,428,000,000 20-F filed 2026-04-16
Related accounting measures — not additional borrowing

Carrying amounts can reflect issuance costs or discounts. Differences between these measures are not necessarily repayments due within a year.

Current lease liabilities
TWD 3,833,000,000
Noncurrent lease liabilities
TWD 31,595,000,000
Noncurrent bonds issued 2025-12-31 TWD 856,227,500,000 20-F filed 2026-04-16
Noncurrent bonds issued 2025-12-31 USD 27,294,500,000 20-F filed 2026-04-16
Noncurrent lease liabilities 2025-12-31 USD 1,007,200,000 20-F filed 2026-04-16
Noncurrent long-term borrowings 2025-12-31 TWD 39,834,500,000 20-F filed 2026-04-16
Noncurrent long-term borrowings 2025-12-31 USD 1,269,800,000 20-F filed 2026-04-16
Noncurrent unsecured bank loans received 2025-12-31 TWD 39,834,500,000 20-F filed 2026-04-16
Instrument and agreement coverage is incomplete. Additional filings are awaiting review.

Covenants

Covenant terms have not yet been verified for this profile.

The balance figures do not establish whether covenants apply or whether the company complies with them.

Loans, facilities and notes

The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.

Key facts CIK 1046179 CUSIP 874039100 13F (30d) 741 filings 707 filers Visit website Investor relations