Taiwan Semiconductor Manufacturing Co Ltd 6-K, filed Oct 23, 2020
Taiwan Semiconductor Manufacturing Co Ltd (TSM)
About this 6-K
Taiwan Semiconductor Manufacturing Co Ltd filed this 6-K on October 23, 2020.
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1934 Act Registration No. 1-14700 |
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UNITED STATES |
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SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 |
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FORM 6-K |
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REPORT OF FOREIGN PRIVATE ISSUER THE SECURITIES EXCHANGE ACT OF 1934 |
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For the month of October 2020 |
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Taiwan Semiconductor Manufacturing Company Ltd. (Translation of Registrant’s Name Into English)
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No. 8, Li-Hsin Rd. 6, |
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Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F. |
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Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):□ Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):□ |
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SIGNATURES |
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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. |
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Taiwan Semiconductor Manufacturing Company Ltd. |
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Date: |
October 23, 2020 |
By |
/s/ Wendell Huang |
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Wendell Huang |
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Vice President & Chief Financial Officer |
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Taiwan Semiconductor Manufacturing Company Limited |
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("TSMC"; NYSE: TSM) |
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This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of September 2020. |
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1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: |
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Title |
Name |
Number of shares held as of |
Changes |
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8/31/2020 |
9/30/2020 |
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Senior Vice President |
J.K. Lin |
13,529,979 |
13,533,979 |
4,000 |
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Senior Vice President |
Cliff Hou |
432,976 |
433,907 |
931 |
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Senior Vice President |
Kevin Zhang |
- |
11,000 |
11,000 |
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Vice President and Chief Financial Officer |
Wendell Huang |
1,651,534 |
1,651,552 |
18 |
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Note: Shareholdings include shares held by the related parties. |
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2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: None. |
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3. The acquisition and disposition of assets by TSMC and its subsidiaries: |
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Fixed-income investment: NT$5.0 billion of acquisition and NT$4.2 billion of disposition. |
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4. The capital appropriations approved by TSMC board of directors: Inapplicable. |
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(1) Domestic NT$ unsecured bonds issued: |
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Issuance |
Tranche |
Issuance Period |
Total Amount |
Coupon |
Repayment and |
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109-5 |
A |
Sep. 2020 ~ Sep. 2025 |
NT$4.8 |
0.50% |
Two equal installments in last two years; interest payable annually |
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B |
Sep. 2020 ~ Sep. 2027 |
NT$8.0 |
0.58% |
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C |
Sep. 2020 ~ Sep. 2030 |
NT$2.8 |
0.60% |
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(2) Domestic US$ unsecured bonds issued: |
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Issuance |
Tranche |
Issuance Period |
Total Amount |
Coupon |
Repayment and |
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109-1 |
- |
Sep. 2020 ~ Sep. 2060 |
US$1.0 |
2.70% |
Bullet repayment (callable on the 5th anniversary of the issue date and every anniversary thereafter); interest payable annually |
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(3) Overseas US$ unsecured bonds issued: |
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Issuance Period |
Total Amount |
Coupon |
Repayment and |
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Sep. 2020 ~ Sep. 2025 |
US$1.00 |
0.750% |
Bullet repayment (callable at any time, in whole or in part, at the relevant redemption price according to relevant agreements); interest payable semi-annually |
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Sep. 2020 ~ Sep. 2027 |
US$0.75 |
1.000% |
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Sep. 2020 ~ Sep. 2030 |
US$1.25 |
1.375% |
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