Charles Shee

“Mike, I think you kind of gave away that you think next year advanced packaging probably more than 35% growth, and we've learned from your prior order announcement on the 2.5D side, you're going to have a lot of OSET-related revenue, and it does set up like the 2.5D growth probably still going to be pretty strong into…”

“You're expecting ending the year above the Q2 backlog level. That kind of implies almost maybe 100 million net bookings in Q4.”

“Maybe first I want to clarify and maybe help us unpack the Q3 results and Q4 guidance a little bit. I think roughly 90 days ago, we were under the impression that a half-over-half growth for this year is probably in the high teens range, and obviously I think it's going beat and raise quarter to quarter.”

“Maybe a second question, maybe more on the advanced packaging, especially AI-related advanced packaging outlook between 2.5D and HBM. We know there are some unique situation on the 2.5D side, maybe just a 27 issue, maybe going to 28, not really an issue.”

“Sasinghe, Sheila, thanks for taking my question. This is Charles Shea from Needham. I have a question on lane three, lane number three. I think one of the things people were worried about throughout this year has been can AI design chips completely bypassing the EDA tools, and there has been a thought that”