MX · MAGNACHIP SEMICONDUCTOR Corp · Debt
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Debt Profile
Reported borrowing balances, repayment dates and agreement terms, with links to the underlying filings.
Read debt and covenant terms in your AI or your code through MCP and the API →Reported debt balances
Each amount keeps its reported scope. Related balance-sheet measures appear under the borrowing they describe.
| Reported balance | As of | Amount | Source |
|---|---|---|---|
| Finance lease liabilities | 2026-09-30 | USD 279,000 | 10-Q filed 2026-11-05 |
| Long-term debt, including current maturities | 2026-09-30 | USD 47,110,000 | 10-Q filed 2026-11-05 |
Related accounting measures — not additional borrowingCarrying amounts can reflect issuance costs or discounts. Differences between these measures are not necessarily repayments due within a year.
| |||
| Operating lease liabilities | 2026-09-30 | USD 1,418,000 | 10-Q filed 2026-11-05 |
Related accounting measures — not additional borrowingCarrying amounts can reflect issuance costs or discounts. Differences between these measures are not necessarily repayments due within a year.
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Covenants
Covenant terms have not yet been verified for this profile.
The balance figures do not establish whether covenants apply or whether the company complies with them.
Loans, facilities and notes
The instrument breakdown is not yet verified. Read the debt note in the linked report for borrowing terms and maturity conditions.