WOLF · Wolfspeed, Inc. · Investor Relations

Wolfspeed, Inc. (NYSE: WOLF) today announced its results for the fourth quarter of fiscal 2026. Business Highlights AI data center revenue more than doubled year-over-year in fiscal 2026 and increased approximately 20% sequentially in the fourth quarter, demonstrating the long-term potential of this moderate but growing opportunity. Launched fifth-generation SiC MOSFET, representing a significant advancement in the Company's technology roadmap. 10kV MOSFET named “Top Innovation” at the 2026 Power Conversion and Intelligent Motion conference and announced Memorandum of Understanding with GE Aerospace. Launched a dedicated data center solutions team, based in Silicon Valley, to capitalize on and supplement growth in our fastest growing end market and a strategic collaboration with LITEON Technology. Appointed Andy Mattes, experienced public technology company executive, to the Board of Directors. Quarterly Financial Highlights Consolidated revenue of approximately $150 million, aligned

Wolfspeed, Inc. (NYSE: WOLF) today announced its results for the third quarter of fiscal 2026. Business Highlights Continued sequential quarterly growth in AI data center applications of approximately 30%, reflecting a moderate but expanding part of the Company's business with meaningful long-term potential. Launched first commercially available 10 kV SiC power MOSFET for grid modernization, industrial electrification and AI data center infrastructure. Introduced next-gen TOLT portfolio to address growing AI data center demand. Durham facilities now focused on materials production, further increasing earnings potential of the site. CFIUS clearance and equity issuance to Renesas completes Chapter 11 procedures. Quarterly Financial Highlights Consolidated revenue of approximately $150 million, aligned with midpoint of guidance range. GAAP gross margin of (27)% and Non-GAAP gross margin of (21)%. GAAP net loss of $120 million and adjusted EBITDA of ($62) million. Operating cash flow of

Pursuant to the Company’s focus on strengthening its capital structure, the Company is raising capital from new and existing investors, with the proceeds intended to reduce highest cash cost debt, lower annual interest expense, and reduce total debt Gross proceeds from the Private Placements to redeem approximately $475.9 million of the outstanding Senior Notes Issues approximately $60.0 million of new shares of common stock at a 10.0% premium over the closing price on March 18, 2026 Efforts to strengthen the balance sheet support initiatives to diversify key end markets and capture opportunities in emerging high-voltage applications including AI data centers, industrial and energy, and aerospace and defense markets Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed”) today announced that on March 19, 2026, it entered into separate, privately negotiated subscription agreements with investors pursuant to which Wolfspeed will place (i) $379,000,000 aggregate principal amount of its 3.5%

Wolfspeed is pleased to announce the appointment of Daihui Yu as regional president for Greater China, effective March 16, 2026. In this key leadership position, Yu will oversee the expansion of the company’s business across mainland China, Hong Kong and Taiwan, utilizing his substantial expertise to drive sales growth and strengthen our brand presence in the region. Yu holds a degree in electrical engineering from Wuhan University of Technology and an MBA from Tsinghua University. Prior to joining Wolfspeed, Yu served more than 12 years with Infineon Technologies as senior vice president and head of infrastructure and industry business for Greater China, managing regional sales and marketing functions. Before that, Yu spent 15 years at Schneider Electric in various sales and marketing management roles, accumulating comprehensive experience across diverse industries. He began his career as a control systems R&D engineer at the China Academy of Space Technology. As regional

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. FIGURE 1. Conceptual demonstration of a large 100mm x 100mm interposer substrate enabled by Wolfspeed® 300mm SiC wafer. “As AI workloads continue to increase package size, power density, and integration complexity, we believe new materials foundations will be increasingly important to extend advanced packaging roadmaps,” said Elif Balkas, Chief Technology Officer at Wolfspeed. “Our 300mm silicon carbide platform is designed to align SiC’s material advantages with industry‑standard manufacturing infrastructure and expand the solution space for